SLOA294A June   2020  – April 2024 TPS3851-Q1 , TPS7A16A-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
  5. 2 Types of Faults and Quantitative Random Hardware Failure Metrics
  6. 3 Random Failures Over a Product Lifetime and Estimation of BFR
  7. 4 BFR Estimation Techniques
  8. 5 Siemens SN 29500 FIT model
  9. 6 IEC TR 62380
  10. 7 Recommended Assumptions for BFR Calculations
  11. 8 Special Considerations for Transient Faults
  12. 9 BFR Differences (Due to Package) Between IEC TR 62380 and SN 29500
  13. 10Effect of Power-on Hours on BFR
  14. 11What Can You Expect for TI Products
  15. 12Summary
  16. 13References
  17. 14Revision History

8 Special Considerations for Transient Faults

Soft errors that result from a radiation event (internal or external) that can cause random hardware failures must be accounted for in a BFR estimate. However, do not include soft errors caused by electromagnetic interference or crosstalk in BFR calculations because these are classified as systematic faults, which are manageable by adhering to good design practices. It is possible to modulate transient faults through attributes such as:

  • The technology used
  • The impact of the fault and when applicable
  • Standard versus low alpha versus ultra-low alpha mold compounds in packages

Architectural Vulnerability Factor (AVF) is the probability that a fault in a design structure, due to a soft error, results in a visible error in the final output of the function. According to ISO 26262, do not de-rate the BFR for soft errors based on AVF or safety mechanisms such as error detection and correction (EDAC) circuitry. Thus, it is best to calculate the BFR for soft errors separately for random access memory versus logic blocks in semiconductor components.