SLOA300A October   2021  – April 2022 TLC2272-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC (D) 8 Package
    2. 2.2 TSSOP (PW) 8 Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SOIC (D) 8 Package
    2. 4.2 TSSOP (PW) 8 Package
  6. 5Revision History

1 Overview

This document contains information for TLC2272-Q1 (SOIC (D) 8 and TSSOP (PW) 8 package) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

GUID-4D275EA6-B581-45A0-B55E-2A3C22F8F89D-low.gifFigure 1-1 Functional Block Diagram

TLC2272-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.