SLOA343 August   2024 TPS543820 , TPS543A22 , TPSM843620 , TPSM843A22

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Layout Techniques to Reduce EMI
    1. 2.1 Placement of Passive Components
    2. 2.2 Ground Flooding
    3. 2.3 Minimize Number of Antennas
    4. 2.4 Via Stitching
    5. 2.5 Additional Steps to Minimize Impedance or Noise
  6. 3Designing for EMI-Optimized Layout
  7. 4Test Results for Radiated Interference
  8. 5EMI Filtering
  9. 6Summary
  10. 7References

Ground Flooding

By creating one solid ground plane around power and signal traces, a low impedance shield is created to protect against noise. All boards in this app note were four-layer PCBs. Ground pours were created around power and signal traces on every layer, with one middle layer being entirely ground plane with no power or signal traces. This prevents unwanted interference from both entering and leaving sensitive areas of the circuit due to a decreased return-path resistance. Note that when flooding the ground planes, do not use thermal reliefs. Flood over all same net holes and vias.