10 Revision History
Changes from Revision C (October 2023) to Revision D (October 2024)
- Added DTX package to Package Information table, Pin
Configuration and Functions section, and Thermal Information
table Go
Changes from Revision B (February 2008) to Revision C (October 2023)
- Added Applications, Package Information table, Pin
Functions table, ESD Ratings table, Thermal Information
table, Device Functional Modes,
Application and Implementation
section, Device and Documentation Support section, and Mechanical,
Packaging, and Orderable Information section Go
- Added DBV package to Package Information table Go
- Added DBV package to Pin Configuration and Functions
sectionGo
- Added the thermal value for the DBV package: RθJA = 278.0 °C/W.
Updated the thermal value for the DCK package: RθJA = 293.4 °C/W. Go