SLOS782C July   2013  – May  2017 TAS5760L

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Digital I/O Pins
    6. 7.6  Master Clock
    7. 7.7  Serial Audio Port
    8. 7.8  Protection Circuitry
    9. 7.9  Speaker Amplifier in All Modes
    10. 7.10 Speaker Amplifier in Stereo Bridge-Tied Load (BTL) Mode
    11. 7.11 Speaker Amplifier in Mono Parallel Bridge-Tied Load (PBTL) Mode
    12. 7.12 I²C Control Port
    13. 7.13 Typical Idle, Mute, Shutdown, Operational Power Consumption
    14. 7.14 Typical Speaker Amplifier Performance Characteristics (Stereo BTL Mode)
    15. 7.15 Typical Performance Characteristics (Mono PBTL Mode)
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power Supplies
      2. 9.3.2 Speaker Amplifier Audio Signal Path
        1. 9.3.2.1 Serial Audio Port (SAP)
          1. 9.3.2.1.1 I²S Timing
          2. 9.3.2.1.2 Left-Justified
          3. 9.3.2.1.3 Right-Justified
        2. 9.3.2.2 DC Blocking Filter
        3. 9.3.2.3 Digital Boost and Volume Control
        4. 9.3.2.4 Digital Clipper
        5. 9.3.2.5 Closed-Loop Class-D Amplifier
      3. 9.3.3 Speaker Amplifier Protection Suite
        1. 9.3.3.1 Speaker Amplifier Fault Notification (SPK_FAULT Pin)
        2. 9.3.3.2 DC Detect Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Hardware Control Mode
        1. 9.4.1.1 Speaker Amplifier Shut Down (SPK_SD Pin)
        2. 9.4.1.2 Serial Audio Port in Hardware Control Mode
        3. 9.4.1.3 Soft Clipper Control (SFT_CLIP Pin)
        4. 9.4.1.4 Speaker Amplifier Switching Frequency Select (FREQ/SDA Pin)
        5. 9.4.1.5 Parallel Bridge Tied Load Mode Select (PBTL/SCL Pin)
        6. 9.4.1.6 Speaker Amplifier Sleep Enable (SPK_SLEEP/ADR Pin)
        7. 9.4.1.7 Speaker Amplifier Gain Select (SPK_GAIN [1:0] Pins)
        8. 9.4.1.8 Considerations for Setting the Speaker Amplifier Gain Structure
          1. 9.4.1.8.1 Recommendations for Setting the Speaker Amplifier Gain Structure in Hardware Control Mode
      2. 9.4.2 Software Control Mode
        1. 9.4.2.1 Speaker Amplifier Shut Down (SPK_SD Pin)
        2. 9.4.2.2 Serial Audio Port Controls
          1. 9.4.2.2.1 Serial Audio Port (SAP) Clocking
        3. 9.4.2.3 Parallel Bridge Tied Load Mode via Software Control
        4. 9.4.2.4 Speaker Amplifier Gain Structure
          1. 9.4.2.4.1 Speaker Amplifier Gain in Software Control Mode
          2. 9.4.2.4.2 Considerations for Setting the Speaker Amplifier Gain Structure
          3. 9.4.2.4.3 Recommendations for Setting the Speaker Amplifier Gain Structure in Software Control Mode
        5. 9.4.2.5 I²C Software Control Port
          1. 9.4.2.5.1 Setting the I²C Device Address
          2. 9.4.2.5.2 General Operation of the I²C Control Port
          3. 9.4.2.5.3 Writing to the I²C Control Port
          4. 9.4.2.5.4 Reading from the I²C Control Port
    5. 9.5 Register Maps
      1. 9.5.1 Control Port Registers - Quick Reference
      2. 9.5.2 Control Port Registers - Detailed Description
        1. 9.5.2.1  Device Identification Register (0x00)
        2. 9.5.2.2  Power Control Register (0x01)
        3. 9.5.2.3  Digital Control Register (0x02)
        4. 9.5.2.4  Volume Control Configuration Register (0x03)
        5. 9.5.2.5  Left Channel Volume Control Register (0x04)
        6. 9.5.2.6  Right Channel Volume Control Register (0x05)
        7. 9.5.2.7  Analog Control Register (0x06)
        8. 9.5.2.8  Reserved Register (0x07)
        9. 9.5.2.9  Fault Configuration and Error Status Register (0x08)
        10. 9.5.2.10 Reserved Controls (9 / 0x09) - (15 / 0x0F)
        11. 9.5.2.11 Digital Clipper Control 2 Register (0x10)
        12. 9.5.2.12 Digital Clipper Control 1 Register (0x11)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Stereo BTL Using Software Control
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Startup Procedures- Software Control Mode
          2. 10.2.1.2.2 Shutdown Procedures- Software Control Mode
          3. 10.2.1.2.3 Component Selection and Hardware Connections
            1. 10.2.1.2.3.1 I²C Pullup Resistors
            2. 10.2.1.2.3.2 Digital I/O Connectivity
          4. 10.2.1.2.4 Recommended Startup and Shutdown Procedures
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Stereo BTL Using Hardware Control
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Startup Procedures- Hardware Control Mode
          2. 10.2.2.2.2 Shutdown Procedures- Hardware Control Mode
          3. 10.2.2.2.3 Digital I/O Connectivity
        3. 10.2.2.3 Application Curve
      3. 10.2.3 Mono PBTL Using Software Control
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
          1. 10.2.3.2.1 Startup Procedures- Software Control Mode
          2. 10.2.3.2.2 Shutdown Procedures- Software Control Mode
          3. 10.2.3.2.3 Component Selection and Hardware Connections
            1. 10.2.3.2.3.1 I²C Pull-Up Resistors
            2. 10.2.3.2.3.2 Digital I/O Connectivity
        3. 10.2.3.3 Application Curve
      4. 10.2.4 Mono PBTL Using Hardware Control
        1. 10.2.4.1 Design Requirements
        2. 10.2.4.2 Detailed Design Procedure
          1. 10.2.4.2.1 Startup Procedures- Hardware Control Mode
          2. 10.2.4.2.2 Shutdown Procedures- Hardware Control Mode
          3. 10.2.4.2.3 Component Selection and Hardware Connections
          4. 10.2.4.2.4 Digital I/O Connectivity
        3. 10.2.4.3 Application Curve
      5. 10.2.5 Stereo BTL Using Software Control, 32-Pin DAP Package Option
        1. 10.2.5.1 Design Requirements
        2. 10.2.5.2 Detailed Design Procedure
          1. 10.2.5.2.1 Startup Procedures- Software Control Mode
          2. 10.2.5.2.2 Shutdown Procedures- Software Control Mode
          3. 10.2.5.2.3 Component Selection and Hardware Connections
            1. 10.2.5.2.3.1 I²C Pullup Resistors
            2. 10.2.5.2.3.2 Digital I/O Connectivity
          4. 10.2.5.2.4 Recommended Startup and Shutdown Procedures
        3. 10.2.5.3 Application Curve
      6. 10.2.6 Stereo BTL Using Hardware Control, 32-Pin DAP Package Option
        1. 10.2.6.1 Design Requirements
        2. 10.2.6.2 Detailed Design Procedure
          1. 10.2.6.2.1 Startup Procedures- Hardware Control Mode
          2. 10.2.6.2.2 Shutdown Procedures- Hardware Control Mode
          3. 10.2.6.2.3 Digital I/O Connectivity
        3. 10.2.6.3 Application Curve
      7. 10.2.7 Mono PBTL Using Software Control, 32-Pin DAP Package Option
        1. 10.2.7.1 Design Requirements
        2. 10.2.7.2 Detailed Design Procedure
          1. 10.2.7.2.1 Startup Procedures- Software Control Mode
          2. 10.2.7.2.2 Shutdown Procedures- Software Control Mode
          3. 10.2.7.2.3 Component Selection and Hardware Connections
            1. 10.2.7.2.3.1 I²C Pull-Up Resistors
            2. 10.2.7.2.3.2 Digital I/O Connectivity
        3. 10.2.7.3 Application Curve
      8. 10.2.8 Mono PBTL Using Hardware Control, 32-Pin DAP Package Option
        1. 10.2.8.1 Design Requirements
        2. 10.2.8.2 Detailed Design Procedure
          1. 10.2.8.2.1 Startup Procedures- Hardware Control Mode
          2. 10.2.8.2.2 Shutdown Procedures- Hardware Control Mode
          3. 10.2.8.2.3 Component Selection and Hardware Connections
          4. 10.2.8.2.4 Digital I/O Connectivity
        3. 10.2.8.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 DVDD Supply
    2. 11.2 PVDD Supply
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 General Guidelines for Audio Amplifiers
      2. 12.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
      3. 12.1.3 Optimizing Thermal Performance
        1. 12.1.3.1 Device, Copper, and Component Layout
        2. 12.1.3.2 Stencil Pattern
          1. 12.1.3.2.1 PCB Footprint and Via Arrangement
            1. 12.1.3.2.1.1 Solder Stencil
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

13.2 Community Resources

The following links connect to TI community resources. Linked contents are provided AS IS by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
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13.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

13.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.