SLOU539 October   2020 OPA2863

 

  1.   Trademarks
  2. 1Features
  3. 2EVM Specifications
  4. 3Power Connections
    1. 3.1 Split-Supply Operation
    2. 3.2 Single-Supply Operation
  5. 4Input and Output Connections
  6. 5OPA2863DGKEVM Schematic, Layout, PCB 3D Render, and Bill of Materials
    1. 5.1 Schematic
    2. 5.2 OPA2863DGKEVM Layers
    3. 5.3 PCB 3D render
    4. 5.4 Bill of Materials

5.2 OPA2863DGKEVM Layers

Figure 5-2 to Figure 5-5 show the OPA2863DGKEVM layers.

GUID-20200915-CA0I-HGCX-TX6F-XKJXGG2NLTQQ-low.pngFigure 5-2 OPA2863DGKEVM Top Layer, Signal
GUID-20200915-CA0I-ZVZS-1MTJ-TTV3PHRX0NTK-low.pngFigure 5-3 OPA2863DGKEVM Layer 2
GUID-20200915-CA0I-TB1K-RLFV-KBZF2WNZLZHP-low.pngFigure 5-4 OPA2863DGKEVM Layer 3
GUID-20200915-CA0I-NHVC-GHFM-8MVML7JVMHCB-low.pngFigure 5-5 OPA2863DGKEVM Bottom Layer