SLOU584 September   2024 TRF1305B1

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 General Usage Information
  7. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
      1. 3.2.1 Stack-Up and Material
    3. 3.3 Bill of Materials (BOM)
  8. 4Additional Information
    1. 4.1 Trademarks
  9. 5Related Documentation

3.2.1 Stack-Up and Material

The TRF1305x1-D2D-EVM is a 67-mil, 4-layer board with material type Isola® 370HR. The top layer routes the power, ground, and signals between SMA connectors and the device. The second layer is the reference RF ground layer. The signal trace impedance is targeted at 50Ω. The bottom three layers are ground layers.

TRF1305x1-D2D-EVM TRF1305x1-D2D-EVM Stack-Up (Units in Mils) Figure 3-6 TRF1305x1-D2D-EVM Stack-Up (Units in Mils)