SLUAAH0 February 2022 UCC14130-Q1 , UCC14131-Q1 , UCC14140-Q1 , UCC14141-Q1 , UCC14240-Q1 , UCC14241-Q1 , UCC14340-Q1 , UCC14341-Q1 , UCC15240-Q1 , UCC15241-Q1
Once a bias architecture is decided, the first step for designing the bias supply is determining the power required according to the IGBT or SiC power module gate charge, QG. Table 3-1 highlights some key parameters comparing two 1.2-kV IGBT vs SiC modules.
VCE, VDS (V) | IC, ID (A) | VGE, VGS (V) | VGE/S(th), (V) | QG (µC) | |
---|---|---|---|---|---|
6-pack IGBT | 1200 | 380 | -8/15 | 5.2 | 1.75 |
6-pack SiC | 1200 | 400 | -5/15 | 3.25 | 1.32 |
Knowing QG, VGE(ON), VGE(OFF) and the switching frequency, FSW, the required power, due to dynamic switching, can be calculated according to Equation 1.
There is also power required to support the product of the total bias voltage and gate drive quiescent current, IQ. The quiescent current for a given driver can be obtained from the manufacturers data sheet. Some gate driver IC data sheets specify IQ_VDD and IQ_VEE separately but others can only specify IQ_VDD. For calculating quiescent power, the larger IQ value should be used and the power can be calculated according to Equation 2.
The total required bias power is then given as:
For the purpose of comparison, assume a gate driver such as the UCC21732-Q1 is used for the IGBT and SiC. From the UCC21732-Q1 data sheet, the maximum IQ_VDD is given as 5.9 mA. If both are operating at 20 kHz and switching over their full range of QG, the required gate drive bias power for each of the modules listed in Table 3-1, is given by Equation 4 and Equation 5 as:
In addition to the well-known, dynamic switching and thermal benefits gained from SiC modules, their lower gate charge and ΔVGS offers a less recognized, secondary benefit of a 31.4% reduction in required bias power compared to a similar rated IGBT module.