SLUS678D March   2008  – November 2023 UCC27324-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Overall Electrical Characteristics
    6. 5.6  Power Dissipation Characteristics
    7. 5.7  Input (INA, INB) Electrical Characteristics
    8. 5.8  Output (OUTA, OUTB) Electrical Characteristics
    9. 5.9  Switching Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Stage
      2. 6.3.2 Output Stage
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Parallel Outputs
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Propagation Delay
        2. 7.2.2.2 Source and Sink Capabilities During Miller Plateau
        3. 7.2.2.3 Supply Voltage (VDD)
        4. 7.2.2.4 Drive Current and Power Requirements
      3. 7.2.3 Application Curve
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

GUID-FCEBD355-1999-48AF-8C2F-1272D8531BFE-low.svg
NC – No internal connection
Figure 4-1 D Package8-Pin SOICTop View
Table 4-1 Pin Functions
PIN I/O DESCRIPTION
NO. NAME
1 NC — No connection. Should be grounded.
2 INA I Input A. Input signal of the A driver. Has logic-compatible threshold and hysteresis. If not used, this input should be tied to either VDD or GND. It should not be left floating.
3 GND — Common ground. Should be connected very closely to the source of the power MOSFET that the driver is driving.
4 INB I Input B. Input signal of the B driver. Has logic-compatible threshold and hysteresis. If not used, this input should be tied to either VDD or GND. It should not be left floating.
5 OUTB O Driver output B. The output stage can provide 4-A drive current to the gate of a power MOSFET.
6 VDD I Supply. Supply voltage and the power input connection for this device.
7 OUTA O Driver output A. The output stage can provide 4-A drive current to the gate of a power MOSFET.
8 NC — No connection. Should be grounded.