SLUS696C June   2006  – February 2019 BQ26100

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Standard Serial Communication (SDQ) Timing
    7. 6.7 OTP Programming Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Non-Volatile Memory
      2. 7.3.2 Authentication
      3. 7.3.3 Communication and Power
    4. 7.4 Device Functional Modes
      1. 7.4.1 Profile Command
      2. 7.4.2 Sleep Mode Description
    5. 7.5 Programming
      1. 7.5.1 Communicating with the bq26100 Device
      2. 7.5.2 Memory Descriptions
        1. 7.5.2.1 Non-Volatile OTP Memory
          1. 7.5.2.1.1 General Use – Memory Function Commands 0xF0 (Read) and 0x0F (Write)
          2. 7.5.2.1.2 General Use — Memory Function Commands 0xFA (Read) and 0xAF (Write)
          3. 7.5.2.1.3 Status – Memory Function Commands 0xAA (Read) and 0x55 (Write)
            1. 7.5.2.1.3.1 PAGE LOCK (offset = D431h) [reset = 0h]
              1. Table 5. PAGE LOCK Field Descriptions
        2. 7.5.2.2 Non-Volatile EEPROM Memory
          1. 7.5.2.2.1 General Use – Memory Function Commands 0xE0 (Read) and 0x0E (Write)
      3. 7.5.3 SHA-1 Description
      4. 7.5.4 Key Programming Description
    6. 7.6 Register Maps
      1. 7.6.1 Volatile Register Memory
        1. 7.6.1.1 Message and Digest Registers – Memory Function Command 0xDD (Read) and 0x22 (Write)
        2. 7.6.1.2 Control and Version Registers – Memory Function Command 0x88 (Read) and 0x77 (Write)
          1. 7.6.1.2.1 CTRL Register (address = 0001h) [reset = 1h]
            1. Table 9. Control Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage (SDQ all with respect to VSS) –0.3 7.7 V
Output current (SDQ) 5 mA
TA Operating free-air temperature –40 85 °C
TJ Operating junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.