SLUS822D June   2008  – July 2024 UCC27200-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Stages
      2. 6.3.2 Undervoltage Lockout (UVLO)
      3. 6.3.3 Level Shift
      4. 6.3.4 Boot Diode
      5. 6.3.5 Output Stages
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Threshold Type
        2. 7.2.2.2 VDD Bias Supply Voltage
        3. 7.2.2.3 Peak Source and Sink Currents
        4. 7.2.2.4 Propagation Delay
        5. 7.2.2.5 Power Dissipation
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

11 Revision History

Changes from Revision C (August 2016) to Revision D (July 2024)

  • Changed document title to reflect the device's key features and device part number since this data sheet corresponds to only 1 part number (From: UCC2720x-Q1. To: UCC27200-Q1). Updated to several specifications to reflect the device characteristics. Deleted any reference to UCC27201-Q1 device from this data sheet. Go
  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed Features section: 1) Deleted HBM and CDM ESD classification level to follow latest TI data sheet standards. 2) Changed junction temperature range specification (From: -40°C to 140°C. To: -40°C to 150°C). 4) Changed typical propagation delay (From: 20ns. To: 22ns). 5) Deleted Greater than 1 MHz of Operation since the switching frequency is not a specified parameter. 6) Changed typical bootstrap diode resistance (From: 0.6Ω. To: 0.65Ω).Go
  • Updated Applications section with list of top 5 typical applications.Go
  • Changed Description section to replaced UCC2720x-Q1 with UCC27200-Q1 and deleted any references to UCC27201-Q1.Go
  • Changed Pin Functions table with a change to the power pad description. Go
  • Updated Absolute Maximum Ratings section to remove "Power dissipation at TA = 25°C" and "Lead temperature (soldering, 10s)". Power dissipation can be calculated with thermal metrics in "Thermal Information" table.Go
  • Updated Recommended Operating Conditions: Operating Junction Temperature maximum changed from 140°C to 150°C, and removed Operating Ambient Temperature. Go
  • Updated Thermal Information section to reflect device characteristics. Go
  • Updated Supply Currents specifications in the Electrical Characteristics table: 1) IDD typical changed (From: 0.4mA. To: 0.11mA). 2) UC27200-Q1 IDDO typical changed (From: 2.5mA. To: 1mA). 3) UCC27200-Q1 IDDO maximum changed (From: 4mA. To: 3mA. 4) IHB typical changed (From: 0.4mA. To: 0.065mA). 5) IHBO typical changed (From: 2.5mA. To: 0.9mA). 6) IHBO maximum changed (From: 4mA. To: 3mA). 7) IHBS test condition changed to match VHS maximum recommended operating conditions (From: 110V. To: 105V). 8) IHBSO typical changed (From: 0.1mA. To: 0.03mA).Go
  • Updated Input specifications in the Electrical Characteristics table: 1) UCC27200-Q1 VHIT typical changed (From: 5.8V. To: 6V). 2) UCC27200-Q1 VLIT typical changed (From: 5.4V. To: 5.6V). Go
  • Updated Bootstrap diode specifications in the Electrical Characteristics table: 1) RD test conditions changed (From: 100mA and 80mA. To: 120mA and 100mA). 2) RD typical changed (From: 0.6Ω. To: 0.65Ω). Go
  • Updated LO/HO Gate Driver specifications in the Electrical Characteristics table: 1) VLOL typical changed (From 0.18V. To 0.1V). 2) VLOH typical changed (From: 0.25V. To: 0.13V). Go
  • Removed specifications with test conditions "-40°C to 125°C TJ", since all parameters are specified from -40°C to 150°C TJ (unless otherwise noted). Changed Propagation Delays typical specification (From: 20ns. To: 22ns).Go
  • Updated Output Rise and Fall Time specifications: 1) tR typical changed (From: 0.35us. To: 0.26us). 2) tF typical changed (From: 0.3us. To: 0.22us). Go
  • Updated all plots in Typical Characteristics section to reflect the device's typical specification. Go
  • Updated Typical Application section to display a different application diagram and detailed design procedure since information in legacy data sheet had an outdated circuit with obsolete part numbers. Go
  • Changed application curves to display propagation delay and rise/fall time plots. Go
  • Updated Power Supply Recommendations section to fix 3 typos.Go

Changes from Revision B (March 2016) to Revision C (August 2016)

  • Changed the device temperature grade in the Features section from Grade 0 (–40°C to 150°C) to Grade 1 (–40°C to 125°C) Go
  • Added the Receiving Notification of Documentation Updates sectionGo

Changes from Revision A (November 2008) to Revision B (March 2016)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added AEC-Q100 Qualification bulletsGo
  • Changed device numbers UCC2720x and UCC27200 to UCC2720x-Q1 and UCC27200-Q1 Go
  • Moved references from Additional References section to Related Documentation sectionGo