SLUS907K January   2009  – June 2019 TPS2421-1 , TPS2421-2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CT
      2. 8.3.2 FLT
      3. 8.3.3 GND
      4. 8.3.4 ISET
      5. 8.3.5 VIN
      6. 8.3.6 VOUT
      7. 8.3.7 PG
    4. 8.4 Device Functional Modes
      1. 8.4.1 Startup
      2. 8.4.2 Maximum Allowable Load to Ensure Successful Startup
        1. 8.4.2.1 Enable Pin Considerations
        2. 8.4.2.2 Fault Timer
        3. 8.4.2.3 Normal Operation
        4. 8.4.2.4 Startup into a Short
      3. 8.4.3 Shutdown Modes
        1. 8.4.3.1 Hard Overload - Fast Trip
        2. 8.4.3.2 Overcurrent Shutdown
    5. 8.5 Programming
      1. 8.5.1 Fault (ISET) and Current-Limit (ILIM) Thresholds
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Transient Protection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 PowerPad™
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resource
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

10.1 PowerPad™

When properly mounted the PowerPad package provides significantly greater cooling ability than an ordinary package. To operate at rated power the PowerPAD must be soldered directly to the PC board GND plane directly under the device. The PowerPAD is at GND potential and can be connected using multiple vias to inner layer GND. Other planes, such a the bottom side of the circuit board can be used to increase heat sinking in higher current applications. Refer to Technical Briefs: PowerPad™ Thermally Enhanced Package (SLMA002) and PowerPad™ Made Easy (SLMA004) or more information on using this PowerPad™ package. These documents are available at www.ti.com (Search by Keyword).