SLUS937C December   2009  – December 2019 BQ24072T , BQ24075T , BQ24079T

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Circuit
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Undervoltage Lockout (UVLO)
      2. 9.3.2  Overvoltage Protection (OVP)
      3. 9.3.3  Dynamic Power-Path Management
      4. 9.3.4  Battery Charging
      5. 9.3.5  Charge Current Translator
      6. 9.3.6  Battery Detection and Recharge
      7. 9.3.7  Termination Disable (TD Input, BQ24072T)
      8. 9.3.8  Battery Disconnect (SYSOFF Input)
      9. 9.3.9  Dynamic Charge Timers (TMR Input)
      10. 9.3.10 Status Indicators (PGOOD, CHG)
      11. 9.3.11 Thermal Regulation and Thermal Shutdown
      12. 9.3.12 Battery Pack Temperature Monitoring
    4. 9.4 Device Functional Modes
      1. 9.4.1 Input Source Connected (Adapter or USB)
        1. 9.4.1.1 Input DPM Mode (VIN-DPM)
        2. 9.4.1.2 DPPM Mode
        3. 9.4.1.3 Battery Supplement Mode
      2. 9.4.2 Input Source Not Connected
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Using the BQ24075T, BQ24079T to Disconnect the Battery from the System
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Program the Fast Charge Current (ISET):
          2. 10.2.1.2.2 Program the Input Current Limit (ILIM):
          3. 10.2.1.2.3 Program 6.25-hour Fast-Charge Safety Timer (TMR):
          4. 10.2.1.2.4 TS Function:
          5. 10.2.1.2.5 CHG and PGOOD LED Status:
          6. 10.2.1.2.6 Processor Monitoring Status:
          7. 10.2.1.2.7 System ON/OFF (SYSOFF):
          8. 10.2.1.2.8 Selecting IN, OUT and BAT Capacitors
        3. 10.2.1.3 Application Curves
      2. 10.2.2 BQ24072T in a Host Controlled Charger Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedures
          1. 10.2.2.2.1 Termination Disable:
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power On
      1. 11.1.1 Half-Wave Adapters
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Package
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

12.1 Layout Guidelines

  1. To obtain optimal performance, the decoupling capacitor from IN to GND (thermal pad) and the output filter capacitors from OUT to GND (thermal pad) should be placed as close as possible to the BQ2407xT, with short trace runs to both IN, OUT and GND (thermal pad).
  2. All low-current GND connections should be kept separate from the high-current charge or discharge paths from the battery. Use a single-point ground technique incorporating both the small signal ground path and the power ground path.
  3. The high current charge paths into IN pin and from the OUT pin must be sized appropriately for the maximum charge current in order to avoid voltage drops in these traces.

The BQ2407xT family is packaged in a thermally enhanced MLP package. The package includes a thermal pad to provide an effective thermal contact between the IC and the printed circuit board (PCB); this thermal pad is also the main ground connection for the device. Connect the thermal pad to the PCB ground connection. Full PCB design guidelines for this package are provided in QFN and SON PCB Attachment Application Report.