SLUS987C January   2011  – December 2019 BQ33100

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: General Purpose I/O
    6. 7.6  Supply Current
    7. 7.7  REG27 LDO
    8. 7.8  Coulomb Counter
    9. 7.9  ADC
    10. 7.10 External Capacitor Voltage Balance Drive
    11. 7.11 Capacitor Voltage Monitor
    12. 7.12 Internal Temperature Sensor
    13. 7.13 Thermistor Measurement Support
    14. 7.14 Internal Thermal Shutdown
    15. 7.15 High-Frequency Oscillator
    16. 7.16 Low-Frequency Oscillator
    17. 7.17 RAM Backup
    18. 7.18 Flash
    19. 7.19 Current Protection Thresholds
    20. 7.20 Current Protection Timing
    21. 7.21 Timing Requirements: SMBus
    22. 7.22 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Super Capacitor Measurements
        1. 8.1.1.1 Voltage
        2. 8.1.1.2 Current, Charge, and Discharge Counting
        3. 8.1.1.3 Device Calibration
        4. 8.1.1.4 Temperature
        5. 8.1.1.5 Series Capacitor Configuration
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Capacitance Monitoring and Learning
        1. 8.3.1.1 Monitoring and Control Operational Overview
        2. 8.3.1.2 Main Monitoring Registers
        3. 8.3.1.3 Initial Capacitance at Device Reset
        4. 8.3.1.4 Qualified Capacitance Learning
        5. 8.3.1.5 Health Determination
        6. 8.3.1.6 ESR Measurement
        7. 8.3.1.7 Monitor Operating Modes
      2. 8.3.2 Capacitor Voltage Balancing
      3. 8.3.3 Charge Control
        1. 8.3.3.1 Charge Termination
        2. 8.3.3.2 CHG Override Control
      4. 8.3.4 Lifetime Data Gathering
        1. 8.3.4.1 Lifetime Maximum Temperature
        2. 8.3.4.2 Lifetime Minimum Temperature
        3. 8.3.4.3 Lifetime Maximum Capacitor Voltage
      5. 8.3.5 Safety Detection Features
        1. 8.3.5.1  Capacitor Overvoltage (OV)
        2. 8.3.5.2  Capacitor Voltage Imbalance (CIM)
        3. 8.3.5.3  Weak Capacitor (CLBAD)
        4. 8.3.5.4  Overtemperature (OT)
        5. 8.3.5.5  Overcurrent During Charging (OC Chg)
        6. 8.3.5.6  Overcurrent During Discharging (OC Dsg)
        7. 8.3.5.7  Short-Circuit During Charging (SC Chg)
        8. 8.3.5.8  Short-Circuit During Discharging (SC Dsg)
        9. 8.3.5.9  AFE Watchdog (WDF)
        10. 8.3.5.10 Integrated AFE Communication Fault (AFE_C)
        11. 8.3.5.11 Data Flash Fault (DFF)
        12. 8.3.5.12 FAULT Indication (FAULT Pin)
      6. 8.3.6 Communications
        1. 8.3.6.1 SMBus On and Off State
      7. 8.3.7 Security (Enables and Disables Features)
      8. 8.3.8 Measurement System Calibration
        1. 8.3.8.1  Coulomb Counter Deadband
        2. 8.3.8.2  Auto Calibration
        3. 8.3.8.3  Current Gain
        4. 8.3.8.4  CC Delta
        5. 8.3.8.5  Cap1 K-factor
        6. 8.3.8.6  Cap2 K-factor
        7. 8.3.8.7  Cap3 K-factor
        8. 8.3.8.8  Cap4 K-factor
        9. 8.3.8.9  Cap5 K-factor
        10. 8.3.8.10 K-factor Override Flag
        11. 8.3.8.11 System Voltage K-factor
        12. 8.3.8.12 Stack Voltage K-factor
        13. 8.3.8.13 K-factor Stack Override Flag
        14. 8.3.8.14 CC Offset
        15. 8.3.8.15 Board Offset
        16. 8.3.8.16 Int Temp Offset
        17. 8.3.8.17 Ext1 Temp Offset
        18. 8.3.8.18 CC Current
        19. 8.3.8.19 Voltage Signal
        20. 8.3.8.20 Temp Signal
        21. 8.3.8.21 CC Offset Time
        22. 8.3.8.22 ADC Offset Time
        23. 8.3.8.23 Current Gain Time
        24. 8.3.8.24 Voltage Time
        25. 8.3.8.25 Temperature Time
        26. 8.3.8.26 Cal Mode Timeout
        27. 8.3.8.27 Ext Coef a1..a5, b1..b4, Ext rc0, Ext adc0
        28. 8.3.8.28 Rpad
        29. 8.3.8.29 Rint
        30. 8.3.8.30 Int Coef 1..4, Int Min AD, Int Max Temp
        31. 8.3.8.31 Filter
        32. 8.3.8.32 Deadband
        33. 8.3.8.33 CC Deadband
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Power Modes
    5. 8.5 Programming
      1. 8.5.1 Communications
        1. 8.5.1.1 BQ33100 Slave Address
        2. 8.5.1.2 SMBus On and Off State
        3. 8.5.1.3 Packet Error Checking
      2. 8.5.2 SBS Commands
        1. 8.5.2.1 SBS Command Summary
        2. 8.5.2.2 SBS Command Details
          1. 8.5.2.2.1  ManufacturerAccess (0x00)
            1. 8.5.2.2.1.1  Device Type (0x0001)
            2. 8.5.2.2.1.2  Firmware Version (0x0002)
            3. 8.5.2.2.1.3  Hardware Version (0x0003)
            4. 8.5.2.2.1.4  DF Checksum (0x0004)
            5. 8.5.2.2.1.5  Seal Device (0x0020)
            6. 8.5.2.2.1.6  Lifetime and Capacitor Balancing Enable (0x0021)
            7. 8.5.2.2.1.7  FAULT Activation (0x0030)
            8. 8.5.2.2.1.8  FAULT Clear (0x0031)
            9. 8.5.2.2.1.9  CHGLVL0 Activation (0x0032)
            10. 8.5.2.2.1.10 CHGLVL0 Clear (0x0033)
            11. 8.5.2.2.1.11 CHGLVL1 Activation (0x0033)
            12. 8.5.2.2.1.12 CHGLVL1 Clear (0x0034)
            13. 8.5.2.2.1.13 Learn Load Activation (0x0037)
            14. 8.5.2.2.1.14 Learn Load Clear (0x0038)
            15. 8.5.2.2.1.15 Calibration Mode (0x0040)
            16. 8.5.2.2.1.16 Reset (0x0041)
            17. 8.5.2.2.1.17 Unseal Device (UnsealKey)
            18. 8.5.2.2.1.18 Extended SBS Commands
          2. 8.5.2.2.2  Temperature (0x08)
          3. 8.5.2.2.3  Voltage (0x09)
          4. 8.5.2.2.4  Current (0x0A)
          5. 8.5.2.2.5  ESR (0x0B)
          6. 8.5.2.2.6  RelativeStateofCharge (0x0D)
          7. 8.5.2.2.7  Health (0x0E)
          8. 8.5.2.2.8  Capacitance (0x10)
          9. 8.5.2.2.9  ChargingCurrent (0x14)
          10. 8.5.2.2.10 ChargingVoltage (0x15)
          11. 8.5.2.2.11 CapacitorVoltage5..1 (0x3B..0x3F)
          12. 8.5.2.2.12 Extended SBS Commands
            1. 8.5.2.2.12.1 FETControl(0x46)
            2. 8.5.2.2.12.2 SafetyAlert (0x50)
            3. 8.5.2.2.12.3 SafetyStatus (0x51)
            4. 8.5.2.2.12.4 OperationStatus (0x54)
            5. 8.5.2.2.12.5 SystemVoltage (0x5a)
            6. 8.5.2.2.12.6 UnSealKey(0x60)
            7. 8.5.2.2.12.7 ManufacturerInfo(0x70)
      3. 8.5.3 Data Flash
        1. 8.5.3.1 Accessing Data Flash
        2. 8.5.3.2 Data Flash Interface
        3. 8.5.3.3 Data Flash Summary
        4. 8.5.3.4 Specific Data Flash Programming Details
          1. 8.5.3.4.1  OC Dsg
          2. 8.5.3.4.2  OC Dsg Time
          3. 8.5.3.4.3  SC Dsg Cfg
          4. 8.5.3.4.4  SC Chg Cfg
          5. 8.5.3.4.5  Initial 1st Capacitance
          6. 8.5.3.4.6  Capacitance
          7. 8.5.3.4.7  Firmware Version
          8. 8.5.3.4.8  Hardware Version
          9. 8.5.3.4.9  Manuf. Info
          10. 8.5.3.4.10 Operation Cfg
          11. 8.5.3.4.11 FET ACTION
          12. 8.5.3.4.12 FAULT
          13. 8.5.3.4.13 AFE State_CTL
          14. 8.5.3.4.14 Measurement Margin %
          15. 8.5.3.4.15 Max Dsg Time
          16. 8.5.3.4.16 V Chg Nominal
          17. 8.5.3.4.17 V Chg A
          18. 8.5.3.4.18 V Chg B
          19. 8.5.3.4.19 V Chg Max
          20. 8.5.3.4.20 Min Voltage
          21. 8.5.3.4.21 Learning Frequency
          22. 8.5.3.4.22 Dsg Current Threshold
          23. 8.5.3.4.23 Chg Current Threshold
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting Number of Series Capacitor Support
        2. 9.2.2.2 Selecting Charging Voltage Values
        3. 9.2.2.3 Learning Frequency Selection
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

11.1 Layout Guidelines

A capacitance monitor circuit board is a challenging environment due to the fundamental incompatibility of high current traces and ultra-low current semiconductor devices. The best way to protect against unwanted trace-to-trace coupling is with a component placement where the high-current section is on the opposite side of the board from the electronic devices. Ensure to route high-current traces away from signal traces, which enter the BQ33100 directly. IC references and registers can be disturbed and in rare cases damaged due to magnetic and capacitive coupling from the high-current path.

NOTE

During surge current and ESD events, the high-current traces appear inductive and can couple unwanted noise into sensitive nodes of the gas gauge electronics.

The learning load components can become heated depending on the component values selected. TI recommends that any heat is dissipated away from the BQ33100 to ensure its maximum operating temperature is not exceeded.