SLUSB80E September   2012  – January 2018 BQ24157

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Comparisons
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Operational Flow Chart
    4. 9.4 Feature Description
      1. 9.4.1 Input Voltage Protection
        1. 9.4.1.1 Input Overvoltage Protection
        2. 9.4.1.2 Bad Adaptor Detection/Rejection
        3. 9.4.1.3 Sleep Mode
        4. 9.4.1.4 Input Voltage Based DPM (Special Charger Voltage Threshold)
      2. 9.4.2 Battery Protection
        1. 9.4.2.1 Output Overvoltage Protection
        2. 9.4.2.2 Battery Detection at Power Up in DEFAULT Mode
        3. 9.4.2.3 Battery Short Protection
        4. 9.4.2.4 Battery Detection in Host Mode
      3. 9.4.3 DEFAULT Mode
      4. 9.4.4 USB Friendly Power Up
      5. 9.4.5 Input Current Limiting At Power Up
    5. 9.5 Device Functional Modes
      1. 9.5.1 Charge Mode Operation
        1. 9.5.1.1 Charge Profile
      2. 9.5.2 PWM Controller in Charge Mode
      3. 9.5.3 Battery Charging Process
      4. 9.5.4 Thermal Regulation and Protection
      5. 9.5.5 Charge Status Output, STAT Pin
      6. 9.5.6 Control Bits in Charge Mode
        1. 9.5.6.1 CE Bit (Charge Mode)
        2. 9.5.6.2 RESET Bit
        3. 9.5.6.3 OPA_Mode Bit
      7. 9.5.7 Control Pins in Charge Mode
        1. 9.5.7.1 CD Pin (Charge Disable)
      8. 9.5.8 BOOST Mode Operation
        1. 9.5.8.1 PWM Controller in Boost Mode
        2. 9.5.8.2 Boost Start Up
        3. 9.5.8.3 PFM Mode at Light Load
        4. 9.5.8.4 Protection in Boost Mode
          1. 9.5.8.4.1 Output Overvoltage Protection
          2. 9.5.8.4.2 Output Overload Protection
          3. 9.5.8.4.3 Battery Overvoltage Protection
        5. 9.5.8.5 STAT Pin in Boost Mode
      9. 9.5.9 High Impedance (Hi-Z) Mode
    6. 9.6 Programming
      1. 9.6.1 Serial Interface Description
        1. 9.6.1.1 F/S Mode Protocol
        2. 9.6.1.2 H/S Mode Protocol
        3. 9.6.1.3 I2C Update Sequence
        4. 9.6.1.4 Slave Address Byte
        5. 9.6.1.5 Register Address Byte
    7. 9.7 Register Description
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
        1. 10.1.1.1 Design Requirements
        2. 10.1.1.2 Detailed Design Procedure
      2. 10.1.2 Charge Current Sensing Resistor Selection Guidelines
      3. 10.1.3 Output Inductor and Capacitance Selection Guidelines
    2. 10.2 Typical Performance Curves
  11. 11Power Supply Recommendations
    1. 11.1 System Load After Sensing Resistor
      1. 11.1.1 The Advantages:
      2. 11.1.2 Design Requirements and Potential Issues:
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Summary
      1. 14.1.1 Chip Scale Packaging Dimensions

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

13.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

13.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.4 Trademarks

E2E, NanoFree are trademarks of Texas Instruments.

I2C is a trademark of NXP B.V. Corporation.

13.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.