SLUSBD9A February   2013  – September 2024 UCC27532

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Typical Characteristics
  7. Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Feature Description
      1. 6.2.1 VDD Under Voltage Lockout
      2. 6.2.2 Input Stage
      3. 6.2.3 Enable Function
      4. 6.2.4 Output Stage
      5. 6.2.5 Power Dissipation
    3. 6.3 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
  9. Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Thermal Considerations
  10. Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Input Stage

The input pin of UCC27532 device is based on a standard CMOS compatible input threshold logic that is dependent on the VDD supply voltage. The input threshold is approximately 55% of VDD for rise and 45% of VDD for fall. With 18-V VDD, typical high threshold = 9.4 V and typical low threshold = 7.3 V. The 2.1-V hysteresis offers excellent noise immunity compared to traditional TTL logic implementations, where the hysteresis is typically less than 0.5 V. For proper operation using CMOS input, the input signal level should be at a voltage equal to VDD. Using an input signal slightly larger than the threshold but less than VDD for CMOS input can result in slower propagation delay from input to output for example. This device also features tight control of the input pin threshold voltage levels which eases system design considerations and guarantees stable operation across temperature. The very low input capacitance , typically 20 pF, on these pins reduces loading and increases switching speed.

The device features an important safety function wherein, whenever the input pin is in a floating condition, the output is held in the low state. This is achieved using GND pull-down resistors on the non-inverting input pin (IN pin), as shown in the device block diagram.

The input stage of the driver should preferably be driven by a signal with a short rise or fall time. Caution must be exercised whenever the driver is used with slowly varying input signals, especially in situations where the device is located in a separate daughter board or PCB layout has long input connection traces:

  • High dI/dt current from the driver output coupled with board layout parasitics can cause ground bounce. Since the device features just one GND pin which may be referenced to the power ground, this may interfere with the differential voltage between Input pins and GND and trigger an unintended change of output state. Because of fast 17 ns propagation delay, this can ultimately result in high-frequency oscillations, which increases power dissipation and poses risk of damage
  • 2.1-V input threshold hysteresis boosts noise immunity compared to most other industry standard drivers.

If limiting the rise or fall times to the power device to reduce EMI is necessary, then an external resistance is highly recommended between the output of the driver and the power device instead of adding delays on the input signal. This external resistor has the additional benefit of reducing part of the gate charge related power dissipation in the gate driver device package and transferring it into the external resistor itself.