SLUSCK0G November 2017 – November 2024 UCC21220 , UCC21220A
PRODUCTION DATA
PIN | NO. | TYPE(1) | DESCRIPTION |
---|---|---|---|
DIS | 5 | I | Disables both driver outputs if asserted high or left open, enables if set low. This pin is pulled high internally if left open. It is recommended to tie this pin to ground if not used to achieve better noise immunity. Bypass using a ≈ 1-nF low ESR/ESL capacitor close to DIS pin when connecting to a µC with distance. |
GND | 4 | P | Primary-side ground reference. All signals in the primary side are referenced to this ground. |
INA | 1 | I | Input signal for A channel. INA input has a TTL/CMOS compatible input threshold. This pin is pulled low internally if left open. It is recommended to tie this pin to ground if not used to achieve better noise immunity. |
INB | 2 | I | Input signal for B channel. INB input has a TTL/CMOS compatible input threshold. This pin is pulled low internally if left open. It is recommended to tie this pin to ground if not used to achieve better noise immunity. |
NC | 6 | No internal connection | |
7 | |||
12 | |||
13 | |||
OUTA | 15 | O | Output of driver A. Connect to the gate of the A channel FET or IGBT. |
OUTB | 10 | O | Output of driver B. Connect to the gate of the B channel FET or IGBT. |
VCCI | 3 | P | Primary-side supply voltage. Locally decoupled to GND using a low ESR/ESL capacitor located as close to the device as possible. |
VCCI | 8 | P | This pin is internally shorted to pin 3. |
VDDA | 16 | P | Secondary-side power for driver A. Locally decoupled to VSSA using a low ESR/ESL capacitor located as close to the device as possible. |
VDDB | 11 | P | Secondary-side power for driver B. Locally decoupled to VSSB using a low ESR/ESL capacitor located as close to the device as possible. |
VSSA | 14 | P | Ground for secondary-side driver A. Ground reference for secondary side A channel. |
VSSB | 9 | P | Ground for secondary-side driver B. Ground reference for secondary side B channel. |