SLUSD48C July   2018  – March 2022 UCC24624

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description, Continued
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Management
      2. 8.3.2 Synchronous Rectifier Control
      3. 8.3.3 Turn-off Threshold Adjustment
      4. 8.3.4 Noise Immunity
        1. 8.3.4.1 On-Time Blanking
        2. 8.3.4.2 Off-Time Blanking
        3. 8.3.4.3 Two-Channel Interlock
        4. 8.3.4.4 SR Turn-on Re-arm
        5. 8.3.4.5 Adaptive Turn-on Delay
      5. 8.3.5 Gate Voltage Clamping
      6. 8.3.6 Standby Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 UVLO Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Run Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 MOSFET Selection
        2. 9.2.2.2 Snubber Design
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Custom Design With WEBENCH® Tools
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks

11.1 Layout Guidelines

The printed circuit board (PCB) requires careful layout to minimize current loop areas and track lengths, especially when using single-sided PCBs.

  • Place a ceramic MLCC bypass capacitor as close as possible to REG and GND.
  • Avoid connecting VD1 or VD2 and VSS sense points at locations where stray inductance is added to the SR MOSFET package inductance, as this tends to turn off the SR prematurely.
  • Run a trace from the VD1 or VD2 pin directly to the MOSFET drain pad to avoid sensing voltage across the stray inductance in the SR drain current path.
  • Run a trace from the VSS pin directly to the MOSFET source pad to avoid sensing voltage across the stray inductance in the SR source current path. Because this trace shares both the gate driver path and the MOSFET voltage sensing path, TI recommends making this trace as short as possible.
  • Run parallel traces from VG1 or VG2 and PGND to the SR MOSFET. Include a series gate resistance to dampen ringing if it is needed.