SLUSF53 August 2024 BQ2969
PRODUCTION DATA
THERMAL | THERMAL | BQ2969 | UNIT |
---|---|---|---|
SON | UNIT | ||
(8 PINS) | UNIT | ||
RθJA | Junction-to-ambient thermal resistance | 80.0 | °C/W |
RθJC(top) | Junction-to-case(top) thermal resistance | 102.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 46.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 6.1 | °C/W |
ψJB | Junction-to-board characterization parameter | 46.5 | °C/W |
RθJC(bottom) | Junction-to-case(bottom) thermal resistance | 22.7 | °C/W |