SLUSFK1D January   2024  – June 2024 UCC33420

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Insulation Specifications
    6. 5.6 Safety-Related Certifications
    7. 5.7 Electrical Characteristics
    8. 5.8 External BOM Components
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Enable and Disable
      2. 6.3.2 Output Voltage Soft-Start and Steady-State Regulation
      3. 6.3.3 Protection Features
        1. 6.3.3.1 Input Under-voltage and Over-Voltage Lockout
        2. 6.3.3.2 Output Under-Voltage Protection
        3. 6.3.3.3 Output Over-Voltage Protection
        4. 6.3.3.4 Over-Temperature Protection
        5. 6.3.3.5 Fault Reporting and Auto-Restart
      4. 6.3.4 VCC Output Voltage Selection
      5. 6.3.5 VCC Load Recommended Operating Area
      6. 6.3.6 Electromagnetic Compatibility (EMC) Considerations
    4. 6.4 Device Functional Modes
    5. 6.5 Pre-Production Samples Operating Limits
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical and Packaging Information

8.6 Electrostatic Discharge Caution

UCC33420 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.