SLUUAS1C October   2013  – November 2021 TPS53515

 

  1. Introduction
  2. Description
    1. 2.1 Typical Applications
    2. 2.2 Features
  3. Electrical Performance Specifications
  4. Schematic
  5. Test Setup
    1. 5.1 Test Equipment
    2. 5.2 Recommended Test Setup
  6. Configurations
    1. 6.1 Switching Frequency Selection
    2. 6.2 Mode Selection
    3. 6.3 VDD Pin Supply Selection
  7. Test Procedure
    1. 7.1 Line and Load Regulation and Efficiency Measurement Procedure
    2. 7.2 Control-Loop Gain and Phase-Measurement Procedure
    3. 7.3 List of Test Points
    4. 7.4 Equipment Shutdown
  8. EVM Assembly Drawing and PCB Layout
  9. Bill of Materials
  10. 10Revision History

EVM Assembly Drawing and PCB Layout

The following figures show the design of the TPS53515EVM-PWR587 printed circuit board (see Figure 8-1, Figure 8-2, Figure 8-3, Figure 8-4, Figure 8-5, Figure 8-6, Figure 8-7, and Figure 8-8). The EVM has been designed using a six-layer, 2-oz copper-circuit board.

GUID-78890969-A2BD-4C56-B866-E1C0CFDD8FDE-low.gifFigure 8-1 TPS53515EVM-587 Top-Layer Assembly Drawing
GUID-2CFAC718-59C7-43BC-BA6D-CB66453EC542-low.gifFigure 8-2 TPS53515EVM-587 Bottom-Layer Assembly Drawing
GUID-4AC43F28-0473-432D-A3DE-055F632AE75F-low.gifFigure 8-3 TPS53515EVM-587 Top Layer, Copper
GUID-C39022BC-0140-486D-9C25-9F1EF6B69446-low.gifFigure 8-4 TPS53515EVM-587 Layer Two, Copper
GUID-C95D02AF-D4FD-49C4-82AA-20BD57CC2CCB-low.gifFigure 8-5 TPS53515EVM-587 Layer Three, Copper
GUID-7D3CDE21-4972-460F-AAAF-3FC4577495FE-low.gifFigure 8-6 TPS53515EVM-587 Layer Four, Copper
GUID-3B6BF547-93E5-4673-95B9-61CEFE85793F-low.gifFigure 8-7 TPS53515EVM-587 Layer Five, Copper
GUID-BB999A40-7477-4D11-A251-A61E518BB9ED-low.gifFigure 8-8 TPS53515EVM-587 Bottom Layer, Copper