SLUUC73A March   2020  – December 2023 BQ25616

 

  1.   1
  2.   BQ25616, BQ25616J BMS026 Evaluation Module
  3.   Trademarks
  4. 1Introduction
    1. 1.1 EVM Features
    2. 1.2 I/O Descriptions
  5. 2Test Summary
    1. 2.1 Equipment
    2. 2.2 Equipment Setup
    3. 2.3 Test Procedure
      1. 2.3.1 Initial Settings
      2. 2.3.2 Charge Mode Verification
      3. 2.3.3 Boost Mode Verification
      4. 2.3.4 Helpful Tips
  6. 3PCB Layout Guideline
  7. 4Board Layout
  8. 5Schematic
  9. 6Bill of Materials
  10. 7Revision History

Board Layout

Figure 4-1 through Figure 4-8 show the EVM PCB layout images.

GUID-20231116-SS0I-Z8WR-TVNG-RS4QTKRHS4C7-low.gifFigure 4-1 BMS026 EVM Top Overlay
GUID-20231116-SS0I-JLG5-95KM-RSPDBQ72S20K-low.gifFigure 4-3 BMS026 EVM Top Layer
GUID-20231116-SS0I-LHM5-8RHQ-GZWTV7WLZX6L-low.gifFigure 4-5 BMS026 EVM Signal Layer 2
GUID-20231116-SS0I-DVBS-DJ11-DGWXJKGQNVB9-low.gifFigure 4-7 BMS026 Bottom Solder Mask
GUID-20231116-SS0I-7WV4-CV4B-QPPTN2BW6LRH-low.gifFigure 4-2 BMS026 EVM Top Solder Mask
GUID-20231116-SS0I-RGJJ-58RW-T32MQWCK1RB0-low.gifFigure 4-4 BMS026 EVM Signal Layer 1
GUID-20231116-SS0I-RSZ9-S9XW-1FH3FQXSRBFV-low.gifFigure 4-6 BMS026 EVM Bottom Layer
GUID-20231116-SS0I-81FK-HBJK-HKLXPPLZ6PDV-low.gifFigure 4-8 BMS026 Bottom Overlay