Minimize the switching node rise and
fall times for minimum switching loss. Proper layout of the components minimizing
high-frequency current path loop is important to prevent electrical and magnetic
field radiation and high-frequency resonant problems. This PCB layout priority list
must be followed in the order presented for proper layout:
- Place the input capacitor as close
as possible to the PMID pin and PGND pin connections and use the shortest copper
trace connection or PGND plane.
- Place the inductor input terminal
as close to the SW pin as possible. Minimize the copper area of this trace to
lower electrical and magnetic field radiation but make the trace wide enough to
carry the charging current. Do not use multiple layers in parallel for this
connection. Minimize parasitic capacitance from this area to any other trace or
plane.
- Put an output capacitor near to the inductor and the IC. Tie
ground connections to the IC ground with a short copper trace connection or PGND
plane.
- Route and connect analog ground (AGND) separately from the
power ground (PGND).Connect AGND and PGND together using a power pad as the
single ground connection point or use a 0-Ω resistor to tie.
- Use a single ground connection to tie PGND to the charger ANGD
just beneath the IC. Use ground copper pour but avoid power pins to reduce
inductive and capacitive noise coupling.
- Place decoupling capacitors next to the IC pins and make the
trace connection as short as possible.
- Note the importance that the exposed power pad on the backside
of the IC package be soldered to the PCB ground. Make sure that there are
sufficient thermal vias directly under the IC connecting to the ground plane on
the other layers.
- The via size and number is enough for a given current
path.
See the EVM design for the recommended
component placement with trace and via locations. For the QFN information, see Quad
Flatpack No-Lead Logic Packages and QFN/SON PCB
Attachment.