SLUUCB9A June   2020  – January 2021 BQ25730 , BQ25731

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 EVM Features
    2. 1.2 General Description
  3. 2Test Summary
    1. 2.1 Definitions
    2. 2.2 Equipment
    3. 2.3 Equipment Setup
    4. 2.4 Procedure
      1. 2.4.1 Charge Function
      2. 2.4.2 OTG Function
  4. 3Bill of Materials, Board Layout, and Schematics
    1. 3.1 Bill of Materials
    2. 3.2 Board Assembly Layout
    3. 3.3 Schematic
  5.   Revision History

Board Assembly Layout

Figure 3-1 and Figure 3-6 illustrate the board assembly layout images.

GUID-20210115-CA0I-XPHG-Q4S8-8VXDDSDR4S9J-low.gifFigure 3-1 Top Assembly
GUID-20210115-CA0I-76K7-FQDJ-HCHMB0ZR6VD2-low.gifFigure 3-2 Bottom Assembly
GUID-20210115-CA0I-F64H-VD4F-SNQNRDFZZFNW-low.gifFigure 3-3 PCB Layer 1
GUID-20210115-CA0I-KHQW-CXVT-MXQ7LW9L2D0S-low.gifFigure 3-4 PCB Layer 2
GUID-20210115-CA0I-JCH4-WVJ9-TJZC2WRBG4S2-low.gifFigure 3-5 PCB Layer 3
GUID-20210115-CA0I-GMFQ-WWF0-PRSBFJHZFB0Q-low.gifFigure 3-6 PCB Layer 4