SLUUCJ0 November   2023 BQ76907

 

  1.   1
  2.   Read This First
    1.     About This Manual
    2.     Battery Notational Conventions
    3.     Trademarks
    4.     Glossary
  3. 1 Introduction
  4. 2 Device Description
    1. 2.1 Overview
    2. 2.2 Functional Block Diagram
  5. 3 Device Configuration
    1. 3.1 Direct Commands and Subcommands
    2. 3.2 Configuration Using OTP or Registers
    3. 3.3 Data Formats
      1. 3.3.1 Unsigned Integer
      2. 3.3.2 Integer
      3. 3.3.3 Hex
  6. 4 Device Security
  7. 5 Measurement Subsystem
    1. 5.1 Voltage Measurement
      1. 5.1.1 Voltage Measurement Schedule
      2. 5.1.2 Unused VC Cell Input Pins
      3. 5.1.3 General Purpose ADCIN Functionality
    2. 5.2 Coulomb Counter and Digital Filters
    3. 5.3 Internal Temperature Measurement
    4. 5.4 Thermistor Temperature Measurement
    5. 5.5 Measurement Calibration
  8. 6 Protection Subsystem
    1. 6.1  Protections Overview
    2. 6.2  Protection FET Drivers
    3. 6.3  Cell Overvoltage Protection
    4. 6.4  Cell Undervoltage Protection
    5. 6.5  Short Circuit in Discharge Protection
    6. 6.6  Overcurrent in Charge Protection
    7. 6.7  Overcurrent in Discharge 1 and 2 Protections
    8. 6.8  Current Protection Latch
    9. 6.9  CHG Detector
    10. 6.10 Overtemperature in Charge Protection
    11. 6.11 Overtemperature in Discharge Protection
    12. 6.12 Internal Overtemperature Protection
    13. 6.13 Undertemperature in Charge Protection
    14. 6.14 Undertemperature in Discharge Protection
    15. 6.15 Host Watchdog Protection
    16. 6.16 Cell Open Wire Detection
    17. 6.17 Voltage Reference Measurement Diagnostic Protection
    18. 6.18 VSS Measurement Diagnostic Protection
    19. 6.19 REGOUT Diagnostic Protection
    20. 6.20 LFO Oscillator Integrity Diagnostic Protection
    21. 6.21 Internal Factory Trim Diagnostic Protection
  9. 7 Device Status and Controls
    1. 7.1 0x00 Control Status() and 0x12 Battery Status() Commands
    2. 7.2 LDOs
    3. 7.3 ALERT Pin Operation
    4. 7.4 TS Pin Operation
    5. 7.5 Programmable Timer
    6. 7.6 Device Event Timing
  10. 8 Operational Modes
    1. 8.1 Overview of Operational Modes
    2. 8.2 NORMAL Mode
    3. 8.3 SLEEP Mode
    4. 8.4 DEEPSLEEP Mode
    5. 8.5 SHUTDOWN Mode
    6. 8.6 CONFIG_UPDATE Mode
  11. 9 I2C Serial Communications
    1. 9.1 I2C Serial Communications Interface
  12. 10Cell Balancing
    1. 10.1 Cell Balancing
  13. 11Commands and Subcommands
    1. 11.1 Direct Commands
    2. 11.2 Bit field Definitions for Direct Commands
      1. 11.2.1  Safety Alert A Register
      2. 11.2.2  Safety Status A Register
      3. 11.2.3  Safety Alert B Register
      4. 11.2.4  Safety Status B Register
      5. 11.2.5  Battery Status Register
      6. 11.2.6  Alarm Status Register
      7. 11.2.7  Alarm Raw Status Register
      8. 11.2.8  Alarm Enable Register
      9. 11.2.9  FET CONTROL Register
      10. 11.2.10 REGOUT CONTROL Register
      11. 11.2.11 DSG FET Driver PWM Control Register
      12. 11.2.12 CHG FET Driver PWM Control Register
    3. 11.3 Command-only Subcommands
    4. 11.4 Subcommands with Data
    5. 11.5 Bit field Definitions for Subcommands
      1. 11.5.1 DEVICE NUMBER Register
      2. 11.5.2 FW VERSION Register
      3. 11.5.3 HW VERSION Register
      4. 11.5.4 SECURITY KEYS Register
      5. 11.5.5 CB ACTIVE CELLS Register
      6. 11.5.6 PROG TIMER Register
      7. 11.5.7 PROT RECOVERY Register
  14. 12Data Memory
    1. 12.1 Calibration
      1. 12.1.1 Calibration:Voltage
        1. 12.1.1.1 Calibration:Voltage:Cell 1 Gain
        2. 12.1.1.2 Calibration:Voltage:Cell 2 Gain Delta
        3. 12.1.1.3 Calibration:Voltage:Cell 3 Gain Delta
        4. 12.1.1.4 Calibration:Voltage:Cell 4 and 5 Gain Delta
        5. 12.1.1.5 Calibration:Voltage:Cell 6 and 7 Gain Delta
        6. 12.1.1.6 Calibration:Voltage:Stack Gain
      2. 12.1.2 Calibration:Current
        1. 12.1.2.1 Calibration:Current:Curr Gain
        2. 12.1.2.2 Calibration:Current:Curr Offset
        3. 12.1.2.3 Calibration:Current:CC1 Gain
        4. 12.1.2.4 Calibration:Current:CC1 Offset
      3. 12.1.3 Calibration:Temperature
        1. 12.1.3.1 Calibration:Temperature:TS Offset
        2. 12.1.3.2 Calibration:Temperature:Int Temp Gain
        3. 12.1.3.3 Calibration:Temperature:Int Temp Offset
    2. 12.2 Settings
      1. 12.2.1 Settings:Configuration
        1. 12.2.1.1 Settings:Configuration:Power Config
        2. 12.2.1.2 Settings:Configuration:REGOUT Config
        3. 12.2.1.3 Settings:Configuration:I2C Address
        4. 12.2.1.4 Settings:Configuration:I2C Config
        5. 12.2.1.5 Settings:Configuration:DA Config
        6. 12.2.1.6 Settings:Configuration:Vcell Mode
        7. 12.2.1.7 Settings:Configuration:Default Alarm Mask
        8. 12.2.1.8 Settings:Configuration:FET Options
        9. 12.2.1.9 Settings:Configuration:Charge Detector Time
      2. 12.2.2 Settings:Cell Balancing
        1. 12.2.2.1 Settings:Cell Balancing:Balancing Configuration
        2. 12.2.2.2 Settings:Cell Balancing:Min Temp Threshold
        3. 12.2.2.3 Settings:Cell Balancing:Max Temp Threshold
        4. 12.2.2.4 Settings:Cell Balancing:Max Internal Temp
      3. 12.2.3 Settings:Protection
        1. 12.2.3.1 Settings:Protection:Enabled Protections A
        2. 12.2.3.2 Settings:Protection:Enabled Protections B
        3. 12.2.3.3 Settings:Protection:DSG FET Protections A
        4. 12.2.3.4 Settings:Protection:CHG FET Protections A
        5. 12.2.3.5 Settings:Protection:Both FET Protections B
        6. 12.2.3.6 Settings:Protection:Body Diode Threshold
        7. 12.2.3.7 Settings:Protection:Cell Open Wire NORMAL Check Time
        8. 12.2.3.8 Settings:Protection:Cell Open Wire SLEEP Check Time
        9. 12.2.3.9 Settings:Protection:Host Watchdog Timeout
    3. 12.3 Protections
      1. 12.3.1 Protections:Cell Voltage
        1. 12.3.1.1 Protections:Cell Voltage:Cell Undervoltage Protection Threshold
        2. 12.3.1.2 Protections:Cell Voltage:Cell Undervoltage Protection Delay
        3. 12.3.1.3 Protections:Cell Voltage:Cell Undervoltage Protection Recovery Hysteresis
        4. 12.3.1.4 Protections:Cell Voltage:Cell Overvoltage Protection Threshold
        5. 12.3.1.5 Protections:Cell Voltage:Cell Overvoltage Protection Delay
        6. 12.3.1.6 Protections:Cell Voltage:Cell Overvoltage Protection Recovery Hysteresis
      2. 12.3.2 Protections:Current
        1. 12.3.2.1  Protections:Current:Overcurrent in Charge Protection Threshold
        2. 12.3.2.2  Protections:Current:Overcurrent in Charge Protection Delay
        3. 12.3.2.3  Protections:Current:Overcurrent in Discharge 1 Protection Threshold
        4. 12.3.2.4  Protections:Current:Overcurrent in Discharge 1 Protection Delay
        5. 12.3.2.5  Protections:Current:Overcurrent in Discharge 2 Protection Threshold
        6. 12.3.2.6  Protections:Current:Overcurrent in Discharge 2 Protection Delay
        7. 12.3.2.7  Protections:Current:Short Circuit in Discharge Protection Threshold
        8. 12.3.2.8  Protections:Current:Short Circuit in Discharge Protection Delay
        9. 12.3.2.9  Protections:Current:Latch Limit
        10. 12.3.2.10 Protections:Current:Recovery Time
      3. 12.3.3 Protections:Temperature
        1. 12.3.3.1  Protections:Temperature:Overtemperature in Charge Protection Threshold
        2. 12.3.3.2  Protections:Temperature:Overtemperature in Charge Protection Delay
        3. 12.3.3.3  Protections:Temperature:Overtemperature in Charge Protection Recovery
        4. 12.3.3.4  Protections:Temperature:Undertemperature in Charge Protection Threshold
        5. 12.3.3.5  Protections:Temperature:Undertemperature in Charge Protection Delay
        6. 12.3.3.6  Protections:Temperature:Undertemperature in Charge Protection Recovery
        7. 12.3.3.7  Protections:Temperature:Overtemperature in Discharge Protection Threshold
        8. 12.3.3.8  Protections:Temperature:Overtemperature in Discharge Protection Delay
        9. 12.3.3.9  Protections:Temperature:Overtemperature in Discharge Protection Recovery
        10. 12.3.3.10 Protections:Temperature:Undertemperature in Discharge Protection Threshold
        11. 12.3.3.11 Protections:Temperature:Undertemperature in Discharge Protection Delay
        12. 12.3.3.12 Protections:Temperature:Undertemperature in Discharge Protection Recovery
        13. 12.3.3.13 Protections:Temperature:Internal Overtemperature Protection Threshold
        14. 12.3.3.14 Protections:Temperature:Internal Overtemperature Protection Delay
        15. 12.3.3.15 Protections:Temperature:Internal Overtemperature Protection Recovery
    4. 12.4 Power
      1. 12.4.1 Power:Sleep
        1. 12.4.1.1 Power:Sleep:Sleep Current
        2. 12.4.1.2 Power:Sleep:Voltage Time
        3. 12.4.1.3 Power:Sleep:Wake Comparator Current
      2. 12.4.2 Power:Shutdown
        1. 12.4.2.1 Power:Shutdown:Shutdown Cell Voltage
        2. 12.4.2.2 Power:Shutdown:Shutdown Stack Voltage
        3. 12.4.2.3 Power:Shutdown:Shutdown Temperature
        4. 12.4.2.4 Power:Shutdown:Auto Shutdown Time
    5. 12.5 Security
      1. 12.5.1 Security:Settings
        1. 12.5.1.1 Security:Settings:Security Settings
        2. 12.5.1.2 Security:Settings:Full Access Key Step 1
        3. 12.5.1.3 Security:Settings:Full Access Key Step 2
    6. 12.6 Data Memory Summary
  15. 13Revision History

7.4 TS Pin Operation

The TS pin on the BQ76907 device can be connected to an external thermistor for temperature measurement or can be used as a general purpose ADC input (ADCIN mode). When used for thermistor measurement, the thermistor is connected between the TS pin to VSS, and the pin is internally connected to a 20-kΩ trimmed pullup resistor, which is biased by the internal 1.8V LDO (REG18) voltage. The voltage at the TS pin is digitized by the ADC using the same 1.8 V LDO voltage as the ADC reference, thereby implementing a ratiometric measurement. When the pin is configured for ADCIN mode, the 20-kΩ pullup resistor is disconnected, and the ADC uses VREF1 for its reference.

The selection between the two modes is made using the Settings:Configuration:DA Config[TSMODE] bit. When the bit is set, the TS pin operates in thermistor measurement mode, versus when the bit is cleared it operates in ADCIN mode.

GUID-B9D2FF71-FFBC-4C1E-B99F-43C742F45B7A-low.svgFigure 7-1 BQ76907 TS Pin Configuration

The output of the TS pin ADC measurement is provided by the 0x2A TS Measurement() command. When the pin is configured for thermistor mode, the LSB size of the resulting data is given by

1 LSBThermistor Mode≅ 5 / 3 x VREG18 / 2N-1 ≈ 5 / 3 x 1.8 V / 215 = 92 μV

When the pin is configured for ADCIN mode, the LSB size of the resulting data is given by

1 LSBADCIN Mode≅ 5 / 3 x VREF1 / 2N-1 ≈ 5 / 3 x 1.1962 V / 215 = 61 μV

When the TS pin is configured for thermistor measurement the device enables the internal pullup resistor only while the pin is being measured (which is the default recommended setting). Alternatively, the pullup resistor can be biased continuously by sending the 0x69 REGOUT_CONTROL() command with the [TS_ON] bit set.