SLUUCO1
July 2022
BQ25172
BQ25172EVM Evaluation Module
Trademarks
3
1
Introduction
1.1
Printed Circuit Board Assembly
1.2
I/O Descriptions
2
Test Summary
2.1
Equipment
2.2
Cautions
2.3
Test Instructions
3
Board Layout, Schematic, and Bill of Materials
3.1
Board Layout
3.2
Schematic
3.3
Bill of Materials
4
Revision History
3.1
Board Layout
The board layout is shown in
Figure 3-1
to
Figure 3-6
.
Figure 3-1
Top Overlay
Figure 3-2
Top Solder
Figure 3-3
Top Layer
Figure 3-4
Bottom Layer
Figure 3-5
Bottom Solder
Figure 3-6
Bottom Overlay