SLUUCO5A december   2022  – august 2023 BQ34Z100-R2

 

  1.   1
  2.   Read This First
    1.     About This Manual
    2.     Notational Conventions
    3.     Glossary
    4.     Trademarks
  3. 1 Introduction
  4. 2 Data Commands
    1. 2.1 Standard Data Commands
      1. 2.1.1  Control(): 0x00/0x01
        1. 2.1.1.1  CONTROL_STATUS: 0x0000
        2. 2.1.1.2  DEVICE TYPE: 0x0001
        3. 2.1.1.3  FW_VERSION: 0x0002
        4. 2.1.1.4  HW_VERSION: 0x0003
        5. 2.1.1.5  RESET_DATA: 0x0005
        6. 2.1.1.6  PREV_MACWRITE: 0x0007
        7. 2.1.1.7  CHEM ID: 0x0008
        8. 2.1.1.8  BOARD_OFFSET: 0x0009
        9. 2.1.1.9  CC_OFFSET: 0x000A
        10. 2.1.1.10 CC_OFFSET_SAVE: 0x000B
        11. 2.1.1.11 DF_VERSION: 0x000C
        12. 2.1.1.12 SET_FULLSLEEP: 0x0010
        13. 2.1.1.13 STATIC_CHEM_DF_CHKSUM: 0x0017
        14. 2.1.1.14 SEALED: 0x0020
        15. 2.1.1.15 IT ENABLE: 0x0021
        16. 2.1.1.16 CAL_ENABLE: 0x002D
        17. 2.1.1.17 RESET: 0x0041
        18. 2.1.1.18 EXIT_CAL: 0x0080
        19. 2.1.1.19 ENTER_CAL: 0x0081
        20. 2.1.1.20 OFFSET_CAL: 0x0082
      2. 2.1.2  StateOfCharge(): 0x02
      3. 2.1.3  MaxError(): 0x03
      4. 2.1.4  RemainingCapacity(): 0x04/0x05
      5. 2.1.5  FullChargeCapacity(): 0x06/07
      6. 2.1.6  Voltage(): 0x08/0x09
      7. 2.1.7  AverageCurrent(): 0x0A/0x0B
      8. 2.1.8  Temperature(): 0x0C/0x0D
      9. 2.1.9  Flags(): 0x0E/0x0F
      10. 2.1.10 FlagsB(): 0x12/0x13
      11. 2.1.11 Current(): 0x10/0x11
    2. 2.2 Extended Data Commands
      1. 2.2.1  AverageTimeToEmpty(): 0x18/0x19
      2. 2.2.2  AverageTimeToFull(): 0x1A/0x1B
      3. 2.2.3  PassedCharge(): 0x1C/0x1D
      4. 2.2.4  DOD0Time(): 0x1E/0x1F
      5. 2.2.5  VoltScale(): 0x20
      6. 2.2.6  CurrScale(): 0x21
      7. 2.2.7  EnegyScale(): 0x22
      8. 2.2.8  AvailableEnergy(): 0x24/0x25
      9. 2.2.9  AveragePower(): 0x26/0x27
      10. 2.2.10 SerialNumber(): 0x28/0x29
      11. 2.2.11 InternalTemperature(): 0x2A/0x2B
      12. 2.2.12 CycleCount(): 0x2C/0x2D
      13. 2.2.13 StateOfHealth(): 0x2E/0x2F
      14. 2.2.14 ChargeVoltage(): 0x30/0x31
      15. 2.2.15 ChargeCurrent(): 0x32/0x33
      16. 2.2.16 PackConfiguration(): 0x3A/0x3B
      17. 2.2.17 DesignCapacity(): 0x3C/0x3D
      18. 2.2.18 DataFlashClass(): 0x3E
      19. 2.2.19 DataFlashBlock(): 0x3F
      20. 2.2.20 AuthenticateData/BlockData(): 0x40…0x53
      21. 2.2.21 AuthenticateChecksum/BlockData(): 0x54
      22. 2.2.22 BlockData(): 0x55…0x5F
      23. 2.2.23 BlockDataChecksum(): 0x60
      24. 2.2.24 BlockDataControl(): 0x61
      25. 2.2.25 GridNumber(): 0x62
      26. 2.2.26 LearnedStatus(): 0x63
      27. 2.2.27 Dod@Eoc(): 0x64/0x65
      28. 2.2.28 QStart(): 0x66/0x67
      29. 2.2.29 TrueRC(): 0x68/0x69
      30. 2.2.30 TrueFCC(): 0x6A/0x6B
      31. 2.2.31 StateTime(): 0x6C/0x6D
      32. 2.2.32 QmaxPassedQ(): 0x6E/0x6F
      33. 2.2.33 DOD0(): 0x70/0x71
      34. 2.2.34 QmaxDod0(): 0x72/0x73
      35. 2.2.35 QmaxTime(): 0x74/0x75
      36. 2.2.36 Data Flash Interface
        1. 2.2.36.1 Accessing Data Flash
        2. 2.2.36.2 Manufacturer Information Block
        3. 2.2.36.3 Access Modes
        4. 2.2.36.4 Sealing/Unsealing Data Flash Access
  5. 3 Fuel Gauging
    1. 3.1  Overview
    2. 3.2  Impedance Track Variables
      1. 3.2.1  Load Mode
      2. 3.2.2  Load Select
      3. 3.2.3  Reserve Cap-mAh
      4. 3.2.4  Reserve Cap-mWh/cWh
      5. 3.2.5  Energy Scale
      6. 3.2.6  Dsg Current Threshold
      7. 3.2.7  Chg Current Threshold
      8. 3.2.8  Quit Current, Dsg Relax Time, Chg Relax Time, and Quit Relax Time
      9. 3.2.9  Qmax
      10. 3.2.10 Update Status
      11. 3.2.11 Avg I Last Run
      12. 3.2.12 Avg P Last Run
      13. 3.2.13 Cell Delta Voltage
      14. 3.2.14 Ra Tables
      15. 3.2.15 StateOfCharge() Smoothing
      16. 3.2.16 Charge Efficiency
      17. 3.2.17 Lifetime Data Logging
    3. 3.3  Device Configuration
      1. 3.3.1 Pack Configuration Register
      2. 3.3.2 Pack Configuration B Register
      3. 3.3.3 Pack Configuration C Register
    4. 3.4  Voltage Measurement and Calibration
      1. 3.4.1 1S Example
      2. 3.4.2 7S Example
      3. 3.4.3 Autocalibration
    5. 3.5  Temperature Measurement
    6. 3.6  Overtemperature Indication
      1. 3.6.1 Overtemperature: Charge
      2. 3.6.2 Overtemperature: Discharge
    7. 3.7  Charging and Charge Termination Indication
    8. 3.8  The Scale Factors
    9. 3.9  LED Display
    10. 3.10 Alert Signal
    11. 3.11 Fast Resistance Scaling
      1. 3.11.1 Calculation of Resistance Scale
      2. 3.11.2 Negative Resistance Scale
      3. 3.11.3 Reset of Resistance Scale
      4. 3.11.4 Fast Resistance Scaling Configuration
  6. 4 Communications
    1. 4.1 Authentication
    2. 4.2 Key Programming
    3. 4.3 Executing an Authentication Query
    4. 4.4 HDQ Single-Pin Serial Interface
    5. 4.5 I2C Interface
    6. 4.6 Switching Between I2C and HDQ Modes
      1. 4.6.1 Converting to HDQ Mode
      2. 4.6.2 Converting to I2C Mode
  7. 5 Device Functional Modes
    1. 5.1 NORMAL Mode
    2. 5.2 SLEEP Mode
    3. 5.3 FULL SLEEP Mode
  8. 6 Power Control
    1. 6.1 Reset Functions
    2. 6.2 Wake-Up Comparator
    3. 6.3 Flash Updates
  9. 7 Data Flash Summary
  10. 8 Gas Gauge Timing Considerations
    1. 8.1 Gauging Effects on I2C Transactions
    2. 8.2 HDQ Bus Effects on Gauging
    3. 8.3 Gauging Effects on HDQ Transactions
    4. 8.4 Manufacturer Timing Notes
  11. 9 HDQ Communication Basics
    1. 9.1 Basic HDQ Protocol
    2. 9.2 Break
    3. 9.3 Basic Timing
    4. 9.4 Reading 16-Bit Words
    5. 9.5 Host Processor Interrupts Using Discrete I/O Port for HDQ
    6. 9.6 Using UART Interface to HDQ
  12. 10Procedures to Seal and Unseal the Gauge
    1. 10.1 Unseal the Gauge to UNSEALED Mode
    2. 10.2 Unseal the Gauge to FULL ACCESS Mode
    3. 10.3 Seal the Gauge
  13. 11Impedance Track Gauge Configuration
    1. 11.1 Introduction
    2. 11.2 Determining ChemID
    3. 11.3 Learning Cycle
    4. 11.4 Common Problems Seen During the Learning Cycle
    5. 11.5 Test Gauge and Optimize
    6. 11.6 Finalize Golden File
    7. 11.7 Program and Test the PCB
  14. 12Revision History

2.2.36.2 Manufacturer Information Block

The BQ34Z100-R2 contains 32 bytes of user-programmable data flash storage: Manufacturer Info Block. The method for accessing these memory locations is slightly different, depending on if the device is in UNSEALED or SEALED modes.

When in UNSEALED mode and when an “0x00” has been written to BlockDataControl(), accessing the Manufacturer Info Block is identical to accessing general data flash locations. First, a DataFlashClass() command is used to set the subclass, then a DataFlashBlock() command sets the offset for the first data flash address within the subclass. The BlockData() command codes contain the referenced data flash data. When writing the data flash, a checksum is expected to be received by BlockDataChecksum(). Only when the checksum is received and verified is the data actually written to data flash.

As an example, the data flash location for Manufacturer Info Block is defined as having a Subclass = 58 and an Offset = 0 through 31 (32 byte block). The specification of Class = System Data is not needed to address Manufacturer Info Block, but is used instead for grouping purposes when viewing data flash info in the BQ34Z100-R2 evaluation software.

When in SEALED mode or when “0x01” BlockDataControl() does not contain “0x00”, data flash is no longer available in the manner used in UNSEALED mode. Rather than issuing subclass information, a designated Manufacturer Information Block is selected with the DataFlashBlock() command. Issuing a 0x01, 0x02, or 0x03 with this command causes the corresponding information block (A, B, or C, respectively) to be transferred to the command space 0x40…0x5F for editing or reading by the host. Upon successful writing of checksum information to BlockDataChecksum(), the modified block is returned to data flash.

Note:

Manufacturer Info Block A is “read only” when in SEALED mode.