SLUUCT3 August   2024 LMR51635

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Specification
    3. 1.3 Device Information
  7. 2Hardware Setup and Test Resutls
    1. 2.1 Setup
      1. 2.1.1 Input and Output Connector Description
      2. 2.1.2 Adjusting the Output Voltage
    2. 2.2 Test Results
      1. 2.2.1 Output Voltage Ripple
      2. 2.2.2 Start-Up Relative to VIN
      3. 2.2.3 Start-Up Relative to EN
  8. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials
  9. 4Reference

3.2 PCB Layouts

This section provides a description of the LMR51635EVM, board layout, and layer illustrations.

The board images are shown in LMR51635EVM Top ViewLMR51635EVM Front Photo and Figure 3-3. The board layouts are shown in Figure 3-4 to Figure 3-7. The PCB consists of a 4-layer design. The board size is 55mm × 57mm. 2oz copper planes are applied on top and bottom layers, 1oz copper planes are applied on middle layers.

LMR51635EVM LMR51635EVM Front PhotoFigure 3-2 LMR51635EVM Front Photo
LMR51635EVM Top LayerFigure 3-4 Top Layer
LMR51635EVM Middle Layer 2Figure 3-6 Middle Layer 2
LMR51635EVM LMR51635EVM Back PhotoFigure 3-3 LMR51635EVM Back Photo
LMR51635EVM Middle Layer 1Figure 3-5 Middle Layer 1
LMR51635EVM Bottom LayerFigure 3-7 Bottom Layer