SLUUCT3A August   2024  – November 2024 LMR51635

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware Setup and Test Resutls
    1. 2.1 Setup
      1. 2.1.1 Input and Output Connector Description
      2. 2.1.2 Adjusting the Output Voltage
    2. 2.2 Test Results
      1. 2.2.1 Output Voltage Ripple
      2. 2.2.2 Start-Up Relative to VIN
      3. 2.2.3 Start-Up Relative to EN
  8. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials
  9. 4Additional Information
    1. 4.1 Trademarks
  10. 5Related Documentation
  11. 6Revision History

PCB Layouts

This section provides a description of the LMR51635EVM, board layout, and layer illustrations.

The board images are shown in LMR51635EVM Hardware Top View and Figure 3-3. The board layouts are shown in Figure 3-4 to Figure 3-7. The PCB consists of a 4-layer design. The board size is 55mm × 57mm. 2OZ copper planes are applied on top and bottom layers, 1OZ copper planes are applied on middle layers.

LMR51635EVM LMR51635EVM Top ViewFigure 3-2 LMR51635EVM Top View
LMR51635EVM Top LayerFigure 3-4 Top Layer
LMR51635EVM Middle Layer 2Figure 3-6 Middle Layer 2
LMR51635EVM LMR51635EVM Bottom ViewFigure 3-3 LMR51635EVM Bottom View
LMR51635EVM Middle Layer 1Figure 3-5 Middle Layer 1
LMR51635EVM Bottom LayerFigure 3-7 Bottom Layer