SLUUCY7A November   2023  – October 2024 BQ25750

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Device Information
    4. 1.4 Texas Instruments High Voltage Evaluation User Safety Guidelines
      1. 1.4.1 General Safety Information
  7. 2Hardware
    1. 2.1 Board Parameters
    2. 2.2 IO and Jumper Descriptions
    3. 2.3 Recommended Operating Conditions
    4. 2.4 Communication Interface Setup
      1. 2.4.1 BQSTUDIO using EV2400
      2. 2.4.2 TI Charger GUI for USB2ANY
    5. 2.5 Equipment
      1. 2.5.1 Equipment Set Up
      2. 2.5.2 Equipment - Using a CV Load
      3. 2.5.3 Equipment Setup - Using a CV Load
  8. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
    3. 3.3 Bill of Materials
  9. 4Additional Information
    1. 4.1 Trademarks
  10. 5Revision History

Recommended Operating Conditions

Table 2-5 Recommended Operating Conditions for BQ25750EVM
DescriptionMINTYPMAXUNIT
VIN (J1)Input voltage to the EVM4.255(1)V
VOUT (J3)Output voltage of the EVM3.330(1)V
IIN (J1)Input current of the EVM10(3)(4)A
IOUT (J3)Output current of the EVM10(3)A
Regulator output powerOutput power of the EVM400(3)W
EXT_DRV (J6)Voltage applied to DRV_SUP pin of the regulator411V
EVM Operating Ambient Temperature (TA)25(2)°C
Nodes on the EVM can have high spikes above the input voltage (in buck mode) or output voltage (in boost mode) level due to the high di/dt and dv/dt electrical flow associated with switch-mode power supplies. Switch node voltage can swing up to input or output + inductive spike level. High-side gate drives can swing up to switch node voltage + 11 V (DRV_SUP supply voltage dependent) + gate drive inductive spike level. Observe safety precautions at all times.
Connectors, bump-ons, and jumpers on the EVM are not good choices for evaluation under temperatures that greatly deviate from a room temperature of 25°C. Please refer to the Bill of Materials (BOM) for temperature ratings of board components.
TI recommends thermal monitoring (for example, using a thermal camera) if the power-stage output current > 5 A or total output power > 100 W.
The default EVM input current limit is set to 8 A through the IIN pin. The current-limiting feature can be turned off by setting the EN_IIN_PIN bit to '0', changing the IIN pin resistor, or shorting the IIN pin to PGND through JP11.