SLVA528D September   2012  – August 2021 TPS65381-Q1 , TPS65381A-Q1

 

  1.   Trademarks
  2. 1Introduction
  3. 2Product Overview
    1. 2.1 Safety Functions and Diagnostics Overview
    2. 2.2 Target Applications
    3. 2.3 Product Safety Constraints
  4. 3Development Process for Management of Systematic Faults
    1. 3.1 TI New-Product Development Process
  5. 4TPS65381x-Q1 Product Architecture for Management of Random Faults
    1. 4.1 Device Operating States
    2.     Device Operating States (continued)
    3. 4.2 NRES (MCU Reset) Driver and ENDRV (SAFING Path Enable) Driver
  6. 5TPS65381x-Q1 Architecture Safety Mechanisms and Assumptions of Use
    1. 5.1 Power Supply
    2. 5.2 Regulated Supplies
      1. 5.2.1 VDD6 Buck Switch-Mode Supply
      2. 5.2.2 VDD5 Linear Supply
      3. 5.2.3 VDD3/5 Linear Supply
      4. 5.2.4 VDD1 Linear Supply
      5. 5.2.5 VSOUT1 Linear Supply
      6. 5.2.6 Charge Pump
    3. 5.3 Diagnostic, Monitoring, and Protection Functions
      1. 5.3.1 External MCU Fault Detection and Management
        1. 5.3.1.1 External MCU Error Signal Monitor (MCU ESM)
        2. 5.3.1.2 Watchdog Timer
      2. 5.3.2 Voltage Monitor (VMON)
      3. 5.3.3 Loss-of-Clock Monitor (LCMON)
      4. 5.3.4 Junction Temperature Monitoring and Current Limiting
      5. 5.3.5 Analog and Digital MUX (AMUX and DMUX) and Diagnostic Output Pin (DIAG_OUT)
      6. 5.3.6 Analog Built-In Self-Test (ABIST)
      7. 5.3.7 Logic Built-In Self-Test (LBIST)
      8. 5.3.8 Device Configuration Register Protection
  7. 6Application Diagrams
    1. 6.1 TPS65381x-Q1 With TMS570
    2. 6.2 TPS65381x-Q1 With C2000
    3. 6.3 TPS65381x-Q1 With TMS470
  8. 7TPS65381x-Q1 as Safety Element out of Context (SEooC)
    1. 7.1 TPS65381x-Q1 Used in an EV/HEV Inverter System
    2. 7.2 SPI Note
  9. 8Revision History

3 Development Process for Management of Systematic Faults

For functional safety development, it is necessary to manage both systematic and random faults. Texas Instruments follows a new-product development process for all of its components which helps to decrease the probability of systematic failures. This new-product development process is described in Section 3.1.