SLVAEJ9A December   2019  – July 2021 TPS1HA08-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
  6. 5Revision History

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TPS1HA08-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to Ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 shows the TPS1HA08-Q1 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TPS1HA08-Q1 data sheet.

GUID-16AFB043-D9C0-4089-ABEF-FB8EB9E1D19A-low.gif Figure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • Follow data sheet recommendation for operating conditions, external component selection and PCB layout
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
GND1Resistor/diode network will be bypassed if present.B
SNS2SNS current diagnostic not available.B
LATCH 3 Normal operation. With device in auto-retry mode. B
EN 4 Normal operation with output off (FET turned off). B
ST 5 Open drain fault diagnostics cannot be reported. B
VOUT 6, 7, 8, 9, 10, 11 Short to GND protection kicks in to protect the device. B
NC 12, 13 No effect. D
SEL1 14 Normal operation with diagnostics corresponding to SEL1=LOW. B
SEL2 15 Normal operation with diagnostics corresponding to SEL2=LOW. B
DIAG_EN 16 Normal operation with diagnostics function disabled. B
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
GND 1 The output FET is turned off. B
SNS 2 SNS current diagnostic not available. B
LATCH 3 Normal operation with device in auto-retry mode. Internal pull-down resistor will pull pin to GND. B
EN 4 Normal operation with output off (FET turned off). Internal pull-down resistor will pull pin to GND. B
ST 5 Open drain fault diagnostics cannot be reported. B
VOUT 6, 7, 8, 9, 10, 11 Output off. Open load detection will be triggered in off-state while in diagnostics state. B
NC 12, 13 No effect. D
SEL1 14 Normal operation with diagnostics corresponding to SEL1=LOW. Internal pull-down resistor will pull pin to GND. B
SEL2 15 Normal operation with diagnostics corresponding to SEL2=LOW. Internal pull-down resistor will pull pin to GND. B
DIAG_EN 16 Normal operation with diagnostics function disabled. Internal pull-down resistor will pull pin to GND. B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted toDescription of Potential Failure Effect(s)Failure Effect Class
GND 1 2 (SNS) SNS current diagnostic not available. B
SNS 2 3 (LATCH) Undefined device behavior depends on pin voltage. Sense output may not be correct. Latch function may be enabled if pin voltage > VIH; latch function may be disabled if pin voltage < VIL. B
LATCH 3 4 (EN) Device behavior depends on pin voltage. Latch function may be enabled if pin voltage > VIH; latch function may be disabled if pin voltage < VIL. B
EN 4 5 (ST) Undefined device behavior. Channel may be enabled if pin voltage > VIH; channel may be disabled if pin voltage < VIL. Open drain fault reporting could not be correct. B
ST 5 6 (VOUT) Open drain fault diagnostics cannot be reported. VOUT behavior may not be correct. B
VOUT 6, 7, 8, 9, 10, 11 12 (NC) No effect. D
NC 12, 13 14 (SEL1) No effect. D
SEL1 14 15 (SEL2) Device behavior depends on adjacent pin voltage affecting diagnostic output. B
SEL2 15 16 (DIAG_EN) Device behavior depends on adjacent pin voltage affecting diagnostic output. Diagnostic function may be enabled if pin voltage > VIH; Diagnostic function may be disabled if pin voltage < VIL. B
DIAG_EN1615 (SEL2)Device behavior depends on adjacent pin voltage affecting diagnostic output. Diagnostic function may be enabled if pin voltage > VIH; Diagnostic function may be disabled if pin voltage < VIL.B
Table 4-5 Pin FMA for Device Pins Short-Circuited to supply
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
GND 1 Supply power will be bypassed and device will not turn on. B
SNS 2 If pin voltage exceeds the pin data sheet range, it may cause device damage due to voltage breakdown on ESD circuit. A
LATCH 3 If pin voltage exceeds the pin data sheet range, it may cause device damage due to voltage breakdown on ESD circuit. Device behavior depends on supply voltage. A
EN 4 If pin voltage exceeds the pin data sheet range, it may cause device damage due to voltage breakdown on ESD circuit. A
ST 5 Fault indication will be incorrect. B
VOUT 6, 7, 8, 9, 10, 11 Output stuck onto supply. Open load detection will be triggered in off-state diagnostics state. C
NC 12, 13 No effect. D
SEL1 14 If pin voltage exceeds the pin data sheet range, it may cause device damage due to voltage breakdown on ESD circuit. A
SEL2 15 If pin voltage exceeds the pin data sheet range, it may cause device damage due to voltage breakdown on ESD circuit. A
DIAG_EN 16 If pin voltage exceeds the pin data sheet range, it may cause device damage due to voltage breakdown on ESD circuit. A