SLVAF18 March   2021 TPSM5601R5H

 

  1.   Trademarks
  2. 1Noise Origin
    1. 1.1 Parasitic Elements
    2. 1.2 High Frequency Noise and Low Frequency Ripple
  3. 2Effective Construction of a Power Module
    1. 2.1 Noise Reduction
    2. 2.2 TPSM5601R5H Step-Down Power Module
  4. 3Spread Spectrum
    1. 3.1 Concept
    2. 3.2 Tradeoffs
    3. 3.3 Other EMI Mitigation Techniques
    4. 3.4 EMI Results
  5. 4Summary
  6. 5References

2.2 TPSM5601R5H Step-Down Power Module

The TPSM5601R5H power module is a highly integrated 1.5-A power solution that operates from a 4.2-V to 60-V supply voltage with power MOSFETs, a shielded inductor, and passives in a thermally enhanced QFN package. The QFN package uses Enhanced HotRod QFN technology for enhanced thermal performance, small footprint, and low EMI. Figure 2-1 illustrates radiated emission performance of the evaluation module (EVM) board TPSM601R5HEVM passing CISPR 11 Class B. Additionally, the TPSM5601R5HS offers frequency spread-spectrum operation to further mitigated EMI noise.

GUID-20210304-CA0I-PKW7-WG30-JMNWT9MZN4M8-low.svg Figure 2-1 Radiated Emissions 24-V Input, 12-V Output, 1.5-A Load