SLVAFU8 July   2024 TPSI2072-Q1 , TPSI2140-Q1 , TPSI3050 , TPSI3050-Q1 , TPSI3052 , TPSI3052-Q1 , TPSI3100 , TPSI3100-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2What Are Solid-State Relays?
    1. 2.1 History
      1. 2.1.1 Electromechanical Relays
      2. 2.1.2 Solid-State Relays
    2. 2.2 Isolation Technologies
      1. 2.2.1 Isolation Specifications
    3. 2.3 Relay Evolution
  6. 3Failure Mechanisms
    1. 3.1 Arcing in an Electromechanical Relay
    2. 3.2 Photo-degradation in Photo Relays
    3. 3.3 Partial Discharge
    4. 3.4 Time-Dependent Dielectric Breakdown in Capacitive and Inductive Isolation
  7. 4Electromechanical vs. Photo vs. Capacitive or Inductive
    1. 4.1 Electromechanical Relays
      1. 4.1.1 Advantages
        1. 4.1.1.1 No Leakage Current
      2. 4.1.2 Limitations
        1. 4.1.2.1 Switching Speed
        2. 4.1.2.2 Package Size
    2. 4.2 Photo or Optical Relays
      1. 4.2.1 Advantages
        1. 4.2.1.1 Lower EMI
      2. 4.2.2 Limitations
        1. 4.2.2.1 Limited Temperature Range
    3. 4.3 Capacitive or Inductive Based Relays
      1. 4.3.1 Advantages
        1. 4.3.1.1 Auxiliary Power
        2. 4.3.1.2 Bidirectional Communication
      2. 4.3.2 Limitations
        1. 4.3.2.1 EMI
    4. 4.4 Overall Comparison
  8. 5Summary
  9. 6References

4.1.2.1 Switching Speed

Electromechanical relays typically have slower switching speeds than solid-state relays. This is because the current flowing through the metal contacts must reach a certain condition before switching to an open/closed state. As an example, when switching from an open to a closed state, the metal contacts must stop oscillating before applying a current load. This is known as the settling time, and this phenomenon can be found in most electromechanical relays.