SLVK117 October 2022 TPS7H2221-SEP
The TPS7H2221-SP is fabricated in the TI LBC9 process with a back-end-of-line (BEOL) stack consisting of 3 levels of standard thickness aluminum metal on a 0.5-μm pitch. The total stack height from the surface of the passivation to the silicon surface is 5.57 μm based on nominal layer thickness as shown in Figure 5-1. Accounting for energy loss through the 1-mil thick Aramica beam port window, the 40-mm air gap, and the BEOL stack over the TPS7H2221-SEP, the effective LET (LETEFF) at the surface of the silicon substrate, the depth, and the ion range was determined with the SEUSS 2020 Software (provided by the Texas A&M Cyclotron Institute and based on the latest SRIM-2013 [7] models). The results are shown in Table 5-1. The LETEFF vs range for the heavy-ions used is shown on Figure 5-2. The stack was modeled as a homogeneous layer of silicon dioxide (valid since SiO2 and aluminum density are similar).
ION TYPE | ANGLE OF INCIDENCE | DEGRADER STEPS (#) | DEGRADER ANGLE | RANGE IN SILICON | LETEFF (MeV·cm2/mg) |
---|---|---|---|---|---|
129Xe | 0 | 0 | 0 | 214.2 | 42.7 |
109Ag | 0 | 0 | 0 | 99.5 | 46.8 |