SLVK158A November   2023  – June 2024 TPS7H6003-SP

PRODUCTION DATA  

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
  5. 2 Single-Event Effects (SEE)
  6. 3 Device and Test Board Information
  7. 4 Irradiation Facility and Setup
  8. 5 Depth, Range, and LETEFF Calculation
  9. 6 Test Setup and Procedures
  10. 7 Destructive Single-Event Effects (DSEE)
    1. 7.1 Single-Event Latch-up (SEL) Results
    2. 7.2 Single-Event Burnout (SEB) and Single-Event Gate Rupture (SEGR) Results
  11. 8 Single-Event Transients (SET)
  12. 9 Event Rate Calculations
  13. 10Summary
  14.   A References
  15.   B Revision History

6 Test Setup and Procedures

There were five input supplies used to power the TPS7H60x3-SP which provided VIN, VBOOT, EN/HI, PWM/LI, and ASW (ASW with respect to AGND). The VIN for the device was provided through channel 3 of an N6705C power module and ranged from 12V to 14V for SET and DSEE, respectively. The VBOOT for the device was provided by Channel 1 of an N6705C power module and ranged from 12V to 14V SET and DSEE respectively. EN/HI and PWM/LI were provided by a National Instruments PXIe-5433 2-channel AWG or a National Instruments PXIe-4139 depending on the type of test. Lastly, the ASW was provided by a National Instruments PXIe-4137 and forced to 150V.

The primary signals monitored on the EVM were HO and LO and this was done so using two instruments. The first was a NI PXIe-5110 which triggered (based on HO) in two ways, pulse-width at 20% outside width in PWM or IIMSW mode, and window (± 500mV with signal AC coupled) in IIMST mode. The second instrument was a MSO58B oscilloscope which triggered in a similar manner for the LO signal while also monitoring the BP5L signal.

All equipment other than the MSO58B was controlled and monitored using a custom-developed LabVIEW™ program (PXI-RadTest) running on a HP-Z4® desktop computer. The computer communicates with the PXI chassis through an MXI controller and NI PXIe-8381 remote control module. The MSO58B was used using the manufacturer interface. The MSO was set to fast-frame for all SET data collection.

Table 6-1 lists the connections, limits, and compliance values used during the testing. Figure 6-1 shows a block diagram of the setup used for SEE testing of the TPS7H6003-SP.

Table 6-1 Equipment Settings and Parameters Used During the SEE Testing of the TPS7H60X3-SP
Pin NameEquipment UsedCapabilityComplianceRange of Values Used
VINN6705C (CH # 3)20.4V, 50A5A12 to 14V
VBOOTN6705C (CH # 1)60V, 20A5A 12 to 14V
ASWPXIe-4137200V, 1A.5A14 to 150V
EN/HIPXIe-5433 (CH # 0)24VPK-PK, 80MHz—5V to 14V, 500kHz to 2MHz
PXIe-413960V, 3A3A14V
PWM/LIPXIe-5433 (CH # 1)24VPK-PK, 80MHz—5V to 14V, 500kHz to 2MHz
PXIe-413960V, 3A3A14V
LO, BP5LMSO58B6.25GS / s—1GS / s
HOPXIe-5110100MS / s—100MS / s

All boards used for SEE testing were fully checked for functionality. Dry runs were also performed to ensure that the test system was stable under all bias and load conditions prior to being taken to the TAMU facility. During the heavy-ion testing, the LabVIEW control program powered up the TPS7H60x3-SP device and set the external sourcing and monitoring functions of the external equipment. After functionality and stability was confirmed, the beam shutter was opened to expose the device to the heavy-ion beam. The shutter remained open until the target fluence was achieved (determined by external detectors and counters). During irradiation, the NI scope cards continuously monitored the signals. When the output exceeded the pre-defined trigger, a data capture was initiated. No sudden increases in current were observed (outside of normal fluctuations) on any of the test runs and indicated that no SEL or SEB/SEGR events occurred during any of the tests.

TPS7H6003-SP Block Diagram of the SEE Test Setup for the TPS7H60x3-SPFigure 6-1 Block Diagram of the SEE Test Setup for the TPS7H60x3-SP