SLVK172 June   2024 TPS7H3014-SP

 

  1.   1
  2.   TPS7H3014-SP Single-Event Effects (SEE)
  3.   Trademarks
  4. 1 Introduction
  5. 2 Single-Event Effects (SEE)
  6. 3 Device and Test Board Information
  7. 4 Irradiation Facility and Setup
  8. 5 Depth, Range, and LETEFF Calculation
  9. 6 Test Setup and Procedures
  10. 7 Destructive Single-Event Effects (DSEE)
    1. 7.1 Single-Event Latch-Up (SEL) Results
    2. 7.2 Single-Event Burnout (SEB) and Single-Event Gate Rupture (SEGR) Results
  11. 8 Single-Event Transients (SET)
  12. 9 Event Rate Calculations
  13. 10Summary
  14.   A References

1 Introduction

The TPS7H3014-SP is an integrated 3V to 14V, four channel radiation-hardness assured power-supply sequencer. The channel count can be incremented as needed for the application by connecting multiple ICs in a daisy-chain configuration. The device features sequence up and reverse sequence down control signals (UP and DOWN), SEQ-DONE and PWRGD flags to monitor the sequence and power status of the monitored power tree. Other features for the device include:

  • A 599mV ± 1% threshold voltage
  • 24µA ± 3% hysteresis current
  • Common programmable (268µs to 23.37ms) delay timer
    • Valid during sequence up and down
  • Time-to-regulation programmable timer (264µs to 23.63ms) to track rising voltage on SENSEX
    • Valid only during sequence up
  • Open drain FAULT detection pin to monitor internally generated faults

The device is offered in a 14-pin ceramic package. General device information and test conditions are listed in Table 1-1. For more detailed technical specifications, user-guides, and application notes please go to TPS7H3014-SP product page.

Table 1-1 Overview Information
DESCRIPTION(1)DEVICE INFORMATION
TI Part NumberTPS7H3014-SP
Orderable Number5962R23201VXC
Device Function4-channel sequencer
TechnologyLBC7 (Linear BiCMOS 7)
Exposure FacilityRadiation Effects Facility, Cyclotron Institute, Texas A&M University (15MeV/nucleon)
Heavy Ion Fluence per Run1.00 × 107 ions/cm2
Irradiation Temperature25°C (for SEB/SEGR testing), 25°C (for SET testing), and 125°C (for SEL testing)
(1) TI may provide technical, applications or design advice, quality characterization, and reliability data or service, providing these items shall not expand or otherwise affect TI's warranties as set forth in the Texas Instruments Incorporated Standard Terms and Conditions of Sale for Semiconductor Products and no obligation or liability shall arise from Semiconductor Products and no obligation or liability shall arise from TI's provision of such items.