3 Device and Test Board Information

The TPS7H3014-SP is packaged in a 22-pin CFP-HFT ceramic package as shown in Figure 3-1. The TPS7H3014-SP evaluation module was used to evaluate the performance and characteristics of the TPS7H3014-SP under heavy ion radiation. The TPS7H3014EVM-CVAL (Evaluation Module) is shown in Figure 3-2. The actual EVM BOM was modified from the original (or default). The board was configured to be dual-site rather than in daisy-chain. This means both samples on a given board were configured under the same conditions (or configuration). Three different configurations were used during the heavy-ions test campaign, the details are provided on Figure 3-3, Figure 3-4, and Figure 3-5.

Figure 3-1 Photograph of Delidded TPS7H3014-SP [Left] and Pinout Diagram [Right]

Note: The package was delidded to reveal the die face for all heavy-ion testing.

Figure 3-2 TPS7H3014-SP EVM Top View

Figure 3-3 TPS7H3014-SP EVM Schematic for DSEE Testing

Figure 3-4 TPS7H3014-SP EVM Schematic for SET Testing

Figure 3-5 TPS7H3014-SP EVM for Worst-Case SET Testing