SLVS324C July   2001  – October 2020 TPS60400 , TPS60401 , TPS60402 , TPS60403

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Charge-Pump Output Resistance
      2. 8.3.2 Efficiency Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Active-Schottky Diode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Voltage Inverter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Capacitor Selection
          2. 9.2.1.2.2 Input Capacitor (CI)
          3. 9.2.1.2.3 Flying Capacitor (C(fly))
          4. 9.2.1.2.4 Output Capacitor (CO)
          5. 9.2.1.2.5 Power Dissipation
        3. 9.2.1.3 Application Curves
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Device Family Products
    2. 12.2 Related Links
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

11.1 Layout Guidelines

All capacitors should be soldered as close as possible to the IC. A PCB layout proposal for a single-layer board is shown in Figure 11-1. Care has been taken to connect all capacitors as close as possible to the circuit to achieve optimized output voltage ripple performance.