SLVS714B February   2007  – June 2024 TPS2062-1 , TPS2065-1 , TPS2066-1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Typical Characteristics
  7. 6 Parameter Measurement Information
    1.     13
  8. 7 Detailed Description
    1. 7.1  Functional Block Diagram
    2. 7.2  Power Switch
    3. 7.3  Charge Pump
    4. 7.4  Driver
    5. 7.5  Enable ( ENx or ENx)
    6. 7.6  Current Sense
    7. 7.7  Overcurrent
      1. 7.7.1 Overcurrent Conditions (TPS2062-1 and TPS2065-1)
      2. 7.7.2 Overcurrent Conditions (TPS2066-1)
    8. 7.8  Overcurrent ( OCx)
    9. 7.9  Thermal Sense
    10. 7.10 Undervoltage Lockout
    11. 7.11 Discharge Function
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Power-Supply Considerations
      2. 8.1.2  OC Response
      3. 8.1.3  Power Dissipation and Junction Temperature
      4. 8.1.4  Thermal Protection
      5. 8.1.5  Undervoltage Lockout (UVLO)
      6. 8.1.6  Universal Serial Bus (USB) Applications
      7. 8.1.7  Host/Self-Powered and Bus-Powered Hubs
      8. 8.1.8  Low-Power Bus-Powered and High-Power Bus-Powered Functions
      9. 8.1.9  USB Power-Distribution Requirements
      10. 8.1.10 Generic Hot-Plug Applications
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Documentation Support
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

9.6 Electrostatic Discharge Caution

TPS2062-1 TPS2065-1 TPS2066-1 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.