SLVS839H July   2008  – October 2023 TPS54331

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency PWM Control
      2. 7.3.2  Voltage Reference (VREF)
      3. 7.3.3  Bootstrap Voltage (BOOT)
      4. 7.3.4  Enable and Adjustable Input Undervoltage Lockout (VIN UVLO)
      5. 7.3.5  Programmable Slow Start Using SS Pin
      6. 7.3.6  Error Amplifier
      7. 7.3.7  Slope Compensation
      8. 7.3.8  Current-Mode Compensation Design
      9. 7.3.9  Overcurrent Protection and Frequency Shift
      10. 7.3.10 Overvoltage Transient Protection
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Eco-mode
      2. 7.4.2 Operation With VIN < 3.5 V
      3. 7.4.3 Operation With EN Control
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design with WEBENCH® Tools
        2. 8.2.2.2  Switching Frequency
        3. 8.2.2.3  Output Voltage Set-Point
        4. 8.2.2.4  Input Capacitors
        5. 8.2.2.5  Output Filter Components
          1. 8.2.2.5.1 Inductor Selection
        6. 8.2.2.6  Capacitor Selection
        7. 8.2.2.7  Compensation Components
        8. 8.2.2.8  Bootstrap Capacitor
        9. 8.2.2.9  Catch Diode
        10. 8.2.2.10 Output Voltage Limitations
        11. 8.2.2.11 Power Dissipation Estimate
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Electromagnetic Interference (EMI) Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Custom Design with WEBENCH® Tools
    2. 9.2 Support Resources
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

7.3.11 Thermal Shutdown

The device implements an internal thermal shutdown to protect the device if the junction temperature exceeds 165°C. The thermal shutdown forces the device to stop switching when the junction temperature exceeds the thermal trip threshold. When the die temperature decreases below 165°C, the device reinitiates the power-up sequence.