SLVS892F December   2008  – April 2019 TPS61175

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Switching Frequency
      2. 7.3.2 Soft Start
      3. 7.3.3 Overcurrent Protection
      4. 7.3.4 Enable and Thermal Shutdown
      5. 7.3.5 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Minimum ON Time and Pulse Skipping
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design with WEBENCH Tools
        2. 8.2.2.2  Determining the Duty Cycle
        3. 8.2.2.3  Selecting the Inductor
        4. 8.2.2.4  Computing the Maximum Output Current
        5. 8.2.2.5  Setting Output Voltage
        6. 8.2.2.6  Setting the Switching Frequency
        7. 8.2.2.7  Setting the Soft-Start Time
        8. 8.2.2.8  Selecting the Schottky Diode
        9. 8.2.2.9  Selecting the Input and Output Capacitors
        10. 8.2.2.10 Compensating the Small Signal Control Loop
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Development Support
      1. 11.2.1 Custom Design with WEBENCH Tools
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS61175 UNIT
PWP (HTSSOP)
14 PINS
RθJA Junction-to-ambient thermal resistance 45.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 34.9 °C/W
RθJB Junction-to-board thermal resistance 30.1 °C/W
ψJT Junction-to-top characterization parameter 1.5 °C/W
ψJB Junction-to-board characterization parameter 29.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).