SLVS933D July   2009  – December 2020 TPS23753A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Product Information
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Controller Section Only
    6. 7.6 Electrical Characteristics: PoE and Control
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Description
        1. 8.3.1.1  APD
        2. 8.3.1.2  BLNK
        3. 8.3.1.3  CLS
        4. 8.3.1.4  CS
        5. 8.3.1.5  CTL
        6. 8.3.1.6  DEN
        7. 8.3.1.7  FRS
        8. 8.3.1.8  GATE
        9. 8.3.1.9  RTN
        10. 8.3.1.10 VB
        11. 8.3.1.11 VC
        12. 8.3.1.12 VDD
        13. 8.3.1.13 VDD1
        14. 8.3.1.14 VSS
    4. 8.4 Device Functional Modes
      1. 8.4.1  Threshold Voltages
      2. 8.4.2  PoE Start-Up Sequence
      3. 8.4.3  Detection
      4. 8.4.4  Hardware Classification
      5. 8.4.5  Maintain Power Signature (MPS)
      6. 8.4.6  TPS23753A Operation
        1. 8.4.6.1 Start-Up and Converter Operation
        2. 8.4.6.2 PD Self-Protection
        3. 8.4.6.3 Converter Controller Features
      7. 8.4.7  Special Switching MOSFET Considerations
      8. 8.4.8  Thermal Considerations
      9. 8.4.9  FRS and Synchronization
      10. 8.4.10 Blanking – RBLNK
      11. 8.4.11 Current Slope Compensation
      12. 8.4.12 Adapter ORing
      13. 8.4.13 Protection
      14. 8.4.14 Frequency Dithering for Conducted Emissions Control
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Support Resources
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

7.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±2000V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)±500
IEC 61000-4-2 contact discharge(3)±8000
IEC 61000-4-2 air-gap discharge(3)±15000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) Surges per EN61000-4-2, 1999 applied between RJ-45 and output ground and between adapter input and output ground of the TPS23753AEVM-001 (HPA304-001) evaluation module (documentation available on the web). These were the test levels, not the failure threshold.