SLVSA92C November   2011  – September 2020 TPS63060 , TPS63061

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Power Good
      2. 8.3.2 Soft-Start Function
      3. 8.3.3 Short-Circuit Protection
      4. 8.3.4 Overvoltage Protection
      5. 8.3.5 Undervoltage Lockout
      6. 8.3.6 Overtemperature Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Buck-Boost Operation
      2. 8.4.2 Control Loop
      3. 8.4.3 Power-Save Mode
      4. 8.4.4 Synchronization
      5. 8.4.5 Dynamic Voltage Positioning
      6. 8.4.6 Dynamic Current Limit
      7. 8.4.7 Device Enable
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Step One: Output Filter Design
        2. 9.2.2.2 Step Two: Inductor Selection
        3. 9.2.2.3 Step Three: Capacitor Selection
          1. 9.2.2.3.1 Input Capacitors
          2. 9.2.2.3.2 Output Capacitor
          3. 9.2.2.3.3 Bypass Capacitor
        4. 9.2.2.4 Step Four: Setting the Output Voltage
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
  13. 13Mechanical, Packaging, and Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)TPS63060
TPS63061		UNIT
DSC
10 PINS
RθJAJunction-to-ambient thermal resistance48.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance54.8
RθJBJunction-to-board thermal resistance19.8
ψJTJunction-to-top characterization parameter1.1
ψJBJunction-to-board characterization parameter19.6
RθJC(bot)Junction-to-case (bottom) thermal resistance4.2
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.