SLVSAA4G June   2010  – February 2018 TPS65251

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Adjustable Switching Frequency
      2. 8.3.2  Synchronization
      3. 8.3.3  Out-of-Phase Operation
      4. 8.3.4  Delayed Start-Up
      5. 8.3.5  Soft-Start Time
      6. 8.3.6  Adjusting the Output Voltage
      7. 8.3.7  Input Capacitor
      8. 8.3.8  Bootstrap Capacitor
      9. 8.3.9  Error Amplifier
      10. 8.3.10 Loop Compensation
      11. 8.3.11 Slope Compensation
      12. 8.3.12 Powergood
      13. 8.3.13 Current Limit Protection
      14. 8.3.14 Overvoltage Transient Protection
      15. 8.3.15 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Low-Power Mode Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Loop Compensation Circuit
        2. 9.2.2.2  Selecting the Switching Frequency
        3. 9.2.2.3  Output Inductor Selection
        4. 9.2.2.4  Output Capacitor
        5. 9.2.2.5  Input Capacitor
        6. 9.2.2.6  Soft-Start Capacitor
        7. 9.2.2.7  Bootstrap Capacitor Selection
        8. 9.2.2.8  Adjustable Current Limiting Resistor Selection
        9. 9.2.2.9  Output Voltage and Feedback Resistors Selection
        10. 9.2.2.10 Compensation
        11. 9.2.2.11 3.3-V and 6.5-V LDO Regulators
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

8.3.15 Thermal Shutdown

The device implements an internal thermal shutdown to protect itself if the junction temperature exceeds 160°C. The thermal shutdown forces the device to stop switching when the junction temperature exceeds thermal trip threshold. Once the die temperature decreases below 140°C, the device reinitiates the power-up sequence. The thermal shutdown hysteresis is 20°C.