SLVSAG7F November   2011  – November 2021 TPS62130 , TPS62130A , TPS62131 , TPS62132 , TPS62133

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings (1)
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable / Shutdown (EN)
      2. 8.3.2 Soft Start / Tracking (SS/TR)
      3. 8.3.3 Power Good (PG)
      4. 8.3.4 Pin-Selectable Output Voltage (DEF)
      5. 8.3.5 Frequency Selection (FSW)
      6. 8.3.6 Undervoltage Lockout (UVLO)
      7. 8.3.7 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pulse Width Modulation (PWM) Operation
      2. 8.4.2 Power Save Mode Operation
      3. 8.4.3 100% Duty-Cycle Operation
      4. 8.4.4 Current Limit And Short Circuit Protection
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Programming The Output Voltage
        2. 9.2.2.2 External Component Selection
          1. 9.2.2.2.1 Inductor Selection
          2. 9.2.2.2.2 Capacitor Selection
            1. 9.2.2.2.2.1 Output Capacitor
            2. 9.2.2.2.2.2 Input Capacitor
            3. 9.2.2.2.2.3 Soft-Start Capacitor
        3. 9.2.2.3 Tracking Function
        4. 9.2.2.4 Output Filter And Loop Stability
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 LED Power Supply
      2. 9.3.2 Active Output Discharge
      3. 9.3.3 –3.3-V Inverting Power Supply
      4. 9.3.4 Various Output Voltages
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Information
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

11.3 Thermal Information

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

  • Improving the power dissipation capability of the PCB design
  • Improving the thermal coupling of the component to the PCB by soldering the Exposed Thermal Pad
  • Introducing airflow in the system

For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs Application Report and Semiconductor and IC Package Thermal Metrics Application Report.

The TPS6213x is designed for a maximum operating junction temperature (TJ) of 125°C. Therefore, the maximum output power is limited by the power losses that can be dissipated over the actual thermal resistance, given by the package and the surrounding PCB structures. Since the thermal resistance of the package is fixed, increasing the size of the surrounding copper area and improving the thermal connection to the IC can reduce the thermal resistance. To get an improved thermal behavior, it is recommended to use top layer metal to connect the device with wide and thick metal lines. Internal ground layers can connect to vias directly under the IC for improved thermal performance.

If short circuit or overload conditions are present, the device is protected by limiting internal power dissipation. Experimental data, taken from the TPS62130 EVM, shows the maximum ambient temperature (without additional cooling like airflow or heat sink), that can be allowed to limit the junction temperature to at most 125°C (see Figure 9-38).