SLVSAW6H
June 2011 – November 2024
LP2951-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics (Both Legacy and New Chip)
5.6
Timing Requirements (New Chip only)
5.7
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Output Enable
6.3.2
Dropout Voltage
6.3.3
Current Limit
6.3.4
Undervoltage Lockout (UVLO)
6.3.5
Thermal Shutdown
6.4
Device Functional Modes
6.4.1
Shutdown Mode
7
Application and Implementation
7.1
Application Information
7.1.1
Reverse Current
7.1.2
Input and Output Capacitor Requirements
7.1.3
Estimating Junction Temperature
7.1.4
Power Dissipation (PD)
7.2
Typical Application
7.2.1
Design Requirements
7.2.1.1
Recommended Capacitor Types
7.2.1.1.1
Recommended Capacitors (Legacy Chip)
7.2.1.1.1.1
ESR Range (Legacy Chip)
7.2.1.1.2
Recommended Capacitors (New Chip)
7.2.2
Detailed Design Procedure
7.2.2.1
Feedback Resistor Selection
7.2.2.2
Feedforward Capacitor
7.2.3
Application Curves
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Device Support
8.1.1
Development Support
8.1.2
Device Nomenclature
8.2
Documentation Support
8.2.1
Related Documentation
8.3
Receiving Notification of Documentation Updates
8.4
Support Resources
8.5
Trademarks
8.6
Electrostatic Discharge Caution
8.7
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
8.7
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.