SLVSAZ9D June 2012 – February 2018 TPS81256
PRODUCTION DATA.
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
MicroSiP DC/DC Module Package Dimensions
The TPS81256 device is available in a 9-bump ball grid array (BGA) package. The package dimensions are: