SLVSC26B November   2013  – May 2024 TPS61162A , TPS61163A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 EasyScale Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Boost Converter
      2. 6.3.2  IFBx Pin Unused
      3. 6.3.3  Enable and Start-up
      4. 6.3.4  Soft Start
      5. 6.3.5  Full-Scale Current Program
      6. 6.3.6  Brightness Control
      7. 6.3.7  Undervoltage Lockout
      8. 6.3.8  Overvoltage Protection
      9. 6.3.9  Overcurrent Protection
      10. 6.3.10 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 One-Wire Digital Interface (EasyScale Interface)
      2. 6.4.2 PWM Control Interface
    5. 6.5 Programming
      1. 6.5.1 EasyScale Programming
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Inductor Selection
        2. 7.2.2.2 Schottky Diode Selection
        3. 7.2.2.3 Compensation Capacitor Selection
        4. 7.2.2.4 Output Capacitor Selection
      3. 7.2.3 Application Curves
      4. 7.2.4 Additional Application Circuits
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Related Links
    3. 8.3 Community Resources
    4. 8.4 Trademarks
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TPS61162A/63A UNIT
YFF (DSBGA)
9 PINS
RθJA Junction-to-ambient thermal resistance 107 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.9 °C/W
RθJB Junction-to-board thermal resistance 18.1 °C/W
ψJT Junction-to-top characterization parameter 4.0 °C/W
ψJB Junction-to-board characterization parameter 18 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance NA °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.