SLVSCN0C june   2014  – may 2023 TPS65263

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Adjusting the Output Voltage
      2. 8.3.2  Enable and Adjusting UVLO
      3. 8.3.3  Soft-Start Time
      4. 8.3.4  Power-Up Sequencing
      5. 8.3.5  V7V Low Dropout Regulator and Bootstrap
      6. 8.3.6  Out-of-Phase Operation
      7. 8.3.7  Output Overvoltage Protection (OVP)
      8. 8.3.8  Pulse Skipping Mode (PSM)
      9. 8.3.9  Slope Compensation
      10. 8.3.10 Overcurrent Protection
        1. 8.3.10.1 High-Side MOSFET Overcurrent Protection
        2. 8.3.10.2 Low-Side MOSFET Overcurrent Protection
      11. 8.3.11 Power Good
      12. 8.3.12 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Serial Interface Description
      2. 8.4.2 I2C Update Sequence
    5. 8.5 Register Maps
      1. 8.5.1 Register Description
      2. 8.5.2 VOUT1_SEL: Vout1 Voltage Selection Register (offset = 0x00H)
      3. 8.5.3 VOUT2_SEL: Vout2 Voltage Selection Register (offset = 0x01H)
      4. 8.5.4 VOUT3_SEL: Vout3 Voltage Selection Register (offset = 0x02H)
      5. 8.5.5 VOUT1_COM: Buck1 Command Register (offset = 0x03H)
      6. 8.5.6 VOUT2_COM: Buck2 Command Register (offset = 0x04H)
      7. 8.5.7 VOUT3_COM: Buck3 Command Register (offset = 0x05H)
      8. 8.5.8 SYS_STATUS: System Status Register (offset = 0x06H)
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Inductor Selection
        2. 9.2.2.2 Output Capacitor Selection
        3. 9.2.2.3 Input Capacitor Selection
        4. 9.2.2.4 Loop Compensation
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)TPS65263UNIT
RHB (32 PINS)
RθJAJunction-to-ambient thermal resistance33.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance25.7
RθJBJunction-to-board thermal resistance7.4
ψJTJunction-to-top characterization parameter0.3
ψJBJunction-to-board characterization parameter7.3
RθJC(bot)Junction-to-case (bottom) thermal resistance2.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.